Removal characteristics of plasma chemical vaporization machining with a pipe electrode for optical fabrication
Applied Optics, Vol. 49, Issue 23, pp. 4434-4440 (2010)
http://dx.doi.org/10.1364/AO.49.004434
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Abstract
Plasma chemical vaporization machining (CVM) is a high-precision chemical shaping method using rf plasma generated in the proximity of an electrode in an atmospheric environment. The purpose of the present study is to clarify the removal characteristics of plasma CVM using a pipe electrode. Polished fused silica plates were processed by plasma CVM, polishing, and precision grinding under various conditions. The removal rate of plasma CVM was about 4 to 1100 times faster than that of polishing, and the maximum removal rate was almost equal to that of precision grinding. The roughness of the resultant surfaces was almost the same as that of the polished surfaces.
© 2010 Optical Society of America
OCIS Codes
(160.2750) Materials : Glass and other amorphous materials
(220.1250) Optical design and fabrication : Aspherics
(220.4610) Optical design and fabrication : Optical fabrication
(240.6700) Optics at surfaces : Surfaces
(350.4600) Other areas of optics : Optical engineering
(350.5400) Other areas of optics : Plasmas
ToC Category:
Optical Design and Fabrication
History
Original Manuscript: April 6, 2010
Revised Manuscript: June 8, 2010
Manuscript Accepted: July 12, 2010
Published: August 6, 2010
Citation
Hideo Takino, Kazuya Yamamura, Yasuhisa Sano, and Yuzo Mori, "Removal characteristics of plasma chemical vaporization machining with a pipe electrode for optical fabrication," Appl. Opt. 49, 4434-4440 (2010)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-49-23-4434
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