OSA's Digital Library

Applied Optics

Applied Optics


  • Editor: Joseph N. Mait
  • Vol. 49, Iss. 28 — Oct. 1, 2010
  • pp: 5480–5485

Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry

Zefang Zhang, Weili Liu, and Zhitang Song  »View Author Affiliations

Applied Optics, Vol. 49, Issue 28, pp. 5480-5485 (2010)

View Full Text Article

Enhanced HTML    Acrobat PDF (739 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



This study explores the effect of particle size and surfactant on the chemical mechanical polishing (CMP) of glass using colloidal silica-based slurry. It was found that the material removal rate strongly depends on the particle size and the types of surfactants and that the rms roughness was independent of particle size and correlated to surfactants. On the basis of polishing results, it was concluded that the main polishing mechanism was changed from indentation mechanism to surface-area mechanism, with the variation of particle size. In addition, the molecular structure, charge type, and lubricating effect of the surfactants play an important role in the dispersion of abrasive particles and in the CMP performance.

© 2010 Optical Society of America

OCIS Codes
(160.0160) Materials : Materials
(160.2750) Materials : Glass and other amorphous materials
(160.2900) Materials : Optical storage materials

ToC Category:

Original Manuscript: July 27, 2010
Revised Manuscript: August 30, 2010
Manuscript Accepted: August 31, 2010
Published: September 30, 2010

Zefang Zhang, Weili Liu, and Zhitang Song, "Particle size and surfactant effects on chemical mechanical polishing of glass using silica-based slurry," Appl. Opt. 49, 5480-5485 (2010)

Sort:  Author  |  Year  |  Journal  |  Reset  


  1. H. Lei, H. Lu, P. Zhang, Z. Zhang, and B. Xiao, “Sub-nanometer precision polishing of glass substrate,” in 7th International Conference on Frontiers of Design and Manufacturing (National Natural Science Foundation of China, 2006), pp. 445–448.
  2. Z. F. Zhang and H. Lei, “Preparation of alpha-alumina/polymethacrylic acid composite abrasive and its CMP performance on glass substrate,” Microelectron. Eng. 85, 714–720(2008).
  3. H. L. Zhu, L. A. Tessaroto, R. Sabia, V. A. Greenhut, M. Smith, and D. E. Niesz, “Chemical mechanical polishing (CMP) anisotropy in sapphire,” Appl. Surf. Sci. 236, 120–130 (2004). [CrossRef]
  4. P. B. Zantye, A. Kumar, and A. K. Sikder, “Chemical mechanical planarization for microelectronics applications,” Mater. Sci. Eng. R 45, 89–220 (2004). [CrossRef]
  5. C. H. Lien and Y. H. Guu, “Optimization of the polishing parameters for the glass substrate of STN-LCD,” Mater. Manuf. Process. 23, 838–843 (2008). [CrossRef]
  6. M. J. Cumbo, D. Fairhurst, S. D. Jacobs, and B. E. Puchebner, “Slurry particle size evolution during the polishing of optical glass,” Appl. Opt. 34, 3743–3755 (1995). [CrossRef] [PubMed]
  7. S. H. Lee, Z. Y. Lu, S. V. Babu, and E. Matijevic, “Chemical mechanical polishing of thermal oxide films using silica particles coated with ceria,” J. Mater. Res. 17, 2744–2749 (2002). [CrossRef]
  8. Z. Zhang, W. Liu, and Z. Song, “Effect of abrasive particle concentration on preliminary chemical mechanical polishing of glass substrate,” Microelectron. Eng. 87, 2168–2172 (2010). [CrossRef]
  9. Z. Zhang, W. Liu, and Z. Song, “Effect of ammonium molybdate concentration on chemical mechanical polishing of glass substrate,” Chin. J. Semicond. (to be published).
  10. Z. Zhang, L. Yu, W. Liu, and Z. Song, “Surface modification of ceria nanoparticles and their chemical mechanical polishing behavior on glass substrate,” Appl. Surf. Sci. 256, 3856–3861(2010). [CrossRef]
  11. Z. Zhang, W. Liu, Z. Song, and X. Hu, “Two-step chemical mechanical polishing of sapphire substrate,” J. Electrochem. Soc. 157, H688–H691 (2010). [CrossRef]
  12. M. Bielmann, U. Mahajan, and R. K. Singh, “Effect of particle size during tungsten chemical mechanical polishing,” Electrochem. Solid-State Lett. 2, 401–403 (1999). [CrossRef]
  13. C. Zhou, L. Shan, S. H. Ng, R. Hight, A. J. Paszkowski, and S. Danyluk, “Effects of nano-scale colloidal abrasive particle size on SiO2 by chemical mechanical polishing,” Mater. Res. Soc. Symp. Proc. 671, M1.6.1–M1.6.7 (2001). [CrossRef]
  14. W. Choi and R. K. Singh, “Roles of colloidal silicon dioxide particles in chemical mechanical polishing of dielectric silicon dioxide,” Jpn. J. Appl. Phys. 44, 8383–8390 (2005). [CrossRef]
  15. W. S. Choi, J. Abiade, S. M. Lee, and R. K. Singh, “Effects of slurry particles on silicon dioxide CMP,” J. Electrochem. Soc. 151, G512–G522 (2004). [CrossRef]
  16. U. Mahajan, M. Bielmann, and R. K. Singh, “Abrasive effects in oxide chemical mechanical polishing,” Mater. Res. Soc. Symp. Proc. 566, 27–32 (2000). [CrossRef]
  17. A. Philipossian and S. Olsen, “Fundamental tribological and removal rate, studies of inter-layer dielectric chemical mechanical planarization,” Jpn. J. Appl. Phys. 42, 6371–6379(2003). [CrossRef]
  18. M. Bielmann, U. Mahajan, R. K. Singh, D. O. Shah, and B. J. Palla, “Enhanced tungsten chemical mechanical polishing using stable alumina slurries,” Electrochem. Solid-State Lett. 2, 148–150 (1999). [CrossRef]
  19. W.-C. Chen and C.-T. Yen, “Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: hydrido-organo siloxane and methyl silsesquioxane,” J. Vac. Sci. Technol. B 18, 201–207 (2000). [CrossRef]
  20. W. Choi, U. Mahajan, S. M. Lee, J. Abiade, and R. K. Singh, “Effect of slurry ionic salts at dielectric silica CMP,” J. Electrochem. Soc. 151, G185–G189 (2004). [CrossRef]
  21. L. Wang, B. Liu, Z. Song, S. Feng, Y. Xiang, and F. Zhang, “Acid and surfactant effect on chemical mechanical polishing of Ge2Sb2Te5,” J. Electrochem. Soc. 156, H699–H702(2009). [CrossRef]
  22. W. Choi, S. M. Lee, and R. K. Singh, “pH and down load effects on silicon dioxide dielectric CMP,” Electrochem. Solid-State Lett. 7, G141–G144 (2004). [CrossRef]

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited