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Applied Optics

Applied Optics


  • Editor: Joseph N. Mait
  • Vol. 52, Iss. 10 — Apr. 1, 2013
  • pp: 1998–2007

Thin-film thickness profile measurement by three-wavelength interference color analysis

Katsuichi Kitagawa  »View Author Affiliations

Applied Optics, Vol. 52, Issue 10, pp. 1998-2007 (2013)

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Conventional transparent film thickness measurement methods such as spectroscopy are essentially capable of measuring only a single point at a time, and their spatial resolution is limited. We propose a film thickness measurement method that is an extension of the global model-fitting algorithm developed for three-wavelength interferometric surface profiling. It estimates the film thickness distribution from an interference color image captured by a color camera with three-wavelength illumination. The proposed method is validated through computer simulations and experiments.

© 2013 Optical Society of America

OCIS Codes
(120.3180) Instrumentation, measurement, and metrology : Interferometry
(120.3940) Instrumentation, measurement, and metrology : Metrology
(240.0310) Optics at surfaces : Thin films
(310.6860) Thin films : Thin films, optical properties

ToC Category:
Instrumentation, Measurement, and Metrology

Original Manuscript: November 2, 2012
Manuscript Accepted: February 14, 2013
Published: March 21, 2013

Virtual Issues
May 17, 2013 Spotlight on Optics

Katsuichi Kitagawa, "Thin-film thickness profile measurement by three-wavelength interference color analysis," Appl. Opt. 52, 1998-2007 (2013)

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