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Applied Optics

Applied Optics

APPLICATIONS-CENTERED RESEARCH IN OPTICS

  • Editor: Joseph N. Mait
  • Vol. 52, Iss. 35 — Dec. 10, 2013
  • pp: 8484–8493

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

K. C. Yung, H. Liem, and H. S. Choy  »View Author Affiliations


Applied Optics, Vol. 52, Issue 35, pp. 8484-8493 (2013)
http://dx.doi.org/10.1364/AO.52.008484


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Abstract

This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. The thermal conductivity of the BN-filled substrate was measured. The temperature distribution and heat flow of the LED package were assessed by thermal profile measurement using an infrared (IR) camera and thermocouples. In addition, the heat transfer process of the LED package assembly in natural convection was also simulated using the computational fluid dynamics method. The optical performance of the LED package was monitored and investigated with various filler contents. The heat conduction mechanism in the substrate was analyzed. IR thermogram showed that the BN-doped substrate could effectively lower the surface temperature of the LED package by 21.5°C compared with the traditional FR4 substrate. According to the IESNA LM 80 lifetime testing method, reduction in LED temperature can prolong the LED’s lifetime by 19,000 h. The optical performance of the LED package assembly was also found to be improved significantly in lighting power by 10%. As a result, the overall heat dissipation capability of the LED package to the surrounding is enhanced, which improves the LED’s efficacy.

© 2013 Optical Society of America

OCIS Codes
(000.6850) General : Thermodynamics
(110.6820) Imaging systems : Thermal imaging
(160.5470) Materials : Polymers

ToC Category:
Materials

History
Original Manuscript: August 9, 2013
Manuscript Accepted: November 1, 2013
Published: December 4, 2013

Citation
K. C. Yung, H. Liem, and H. S. Choy, "Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler," Appl. Opt. 52, 8484-8493 (2013)
http://www.opticsinfobase.org/ao/abstract.cfm?URI=ao-52-35-8484


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References

  1. N. Narendran and Y. M. Gu, “Life of LED-based white light sources,” J. Disp. Technol. 1, 167–171 (2005).
  2. J. Zhou and W. Yan, “Experimental investigation on the performance characteristics of white LEDs used in illumination application,” in Proceedings of the 38th IEEE Power Electronics Specialists Conference (PESC’07), Orlando, Florida, 2007, pp. 1436–1440.
  3. K. W. Garrett and H. M. Rosenberg, “The thermal conductivity of epoxy-resin/powder composite materials,” J. Phys. D 7, 1247–1258 (1974).
  4. H. J. Ott, “Thermal conductivity of composite materials,” J. Plast. Rubber Process. Appl. 1, 9–24 (1981).
  5. P. Procter and J. Solc, “Improved thermal conductivity in microelectronic encapsulants,” IEEE Trans. Compon., Hybrids, Manuf. Technol. 14, 708–713 (1991). [CrossRef]
  6. H. He, R. Fu, Y. Han, Y. Shen, and X. Song, “Thermal conductivity of ceramic particle filled polymer composites and theoretical predictions,” J. Mater. Sci. 42, 6749–6754 (2007). [CrossRef]
  7. D. M. Bigg, “Thermally conductive polymer compositions,” Polym. Compos. 7, 125–140 (1986).
  8. D. P. H. Hasselman and L. D. Johnson, “Effective thermal conductivity of composites with interfacial thermal barrier resistance,” J. Compos. Mater. 21, 508–515 (1987). [CrossRef]
  9. Z. Li, K. Okamoto, Y. Ohki, and T. Tanaka, “Effects of nano-filler addition on partial discharge resistance and dielectric breakdown strength of Micro-Al2O3 Epoxy composite,” IEEE Trans. Dielectr. Electr. Insul. 17, 653–661 (2010). [CrossRef]
  10. MCPCB Applications. Available: http://www.cofan-pcb.com/products/mcpcb.php .
  11. H. M. Cho and H. J. Kim, “Metal-core printed circuit board with alumina layer by aerosol deposition process,” IEEE Electron Device Lett. 29, 991–993 (2008). [CrossRef]
  12. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook: Subsystem Packaging, 3rd ed. (Kluwer Academic, 2001), Part 3, pp. 85–86.
  13. C. I. Nicholls and H. M. Rosenberg, “The excitation spectrum of epoxy resins; neutron diffraction, specific heat and thermal conductivity at low temperatures,” J. Phys. C 17, 1165–1178 (1984). [CrossRef]
  14. A. A. Solomo, J. Fourcade, S. G. Lee, S. K. Kuchibhotla, S. Revankar, P. L. Holman, and J. K. McCoy, “The polymer impregnation and pyrolysis method for producing enhanced conductivity LWR fuels,” in Proceedings of the 2004 International Meeting on LWR Fuel Performance, Orlando, Florida, 2004, pp. 146–155.
  15. J. K. Kim, J. W. Kim, M. I. Kim, and M. S. Song, “Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives,” Macromol. Res. 14, 517–523 (2006). [CrossRef]
  16. M. Hussain, Y. Oku, A. Nakahira, and K. Niihara, “Effects of wet ball-milling on particle dispersion and mechanical properties of particulate epoxy composites,” Mater. Lett. 26, 177–184 (1996). [CrossRef]
  17. P. Bujard, G. Kühlein, S. Ino, and T. Shiobara, “Thermal conductivity of molding compounds for plastic packaging,” IEEE Trans. Compon., Packag., Manuf. Technol., Part A 17, 527–532 (1994). [CrossRef]
  18. Y. S. Xu, D. D. L. Chung, and C. Mroz, “Thermally conducting aluminum nitride polymer-matrix composites,” Composites, Part A 32, 1749–1757 (2001). [CrossRef]
  19. W. Kim, J. W. Bae, I. D. Choi, and Y. S. Kim, “Thermally conductive EMD (Epoxy Molding Compound) for microelectronic encapsulation,” Polym. Eng. Sci. 39, 756–766 (1999). [CrossRef]
  20. W. Bae, W. Kim, S. W. Park, C. S. Ha, and J. K. Lee, “Advanced underfill for high thermal reliability,” J. Appl. Polym. Sci. 83, 2617–2624 (2002). [CrossRef]
  21. M. T. Huang and H. Ishida, “Investigation of the boron nitride/polybenzoxazine interphase,” J. Polym. Sci. B 37, 2360–2372 (1999).
  22. R. S. Pease, “An x-ray study of boron nitride,” Acta Crystallogr. 5, 356–361 (1952). [CrossRef]
  23. C. J. Weng, “Advanced thermal enhancement and management of LED packages,” Int. Commun. Heat Mass Transfer 36, 245–248 (2009). [CrossRef]
  24. B. M. Song, B. Han, A. Bar-Cohen, R. Sharma, and M. Arik, “Hierarchical life prediction model for actively cooled LED based luminaire,” IEEE Trans. Compon., Packag. Technol., Part A 33, 728–737 (2010).
  25. M. H. Chang, D. Das, P. Varde, and M. Pecht, “Light emitting diodes reliability review,” Microelectron. Reliab. 52, 762–782 (2012).
  26. C. T. Yang, W. C. Liu, and C. Y. Liu, “Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package,” Microelectron. Reliab. 52, 855–860 (2012).
  27. B. Witzen, “LED thermal design challenges: tips and techniques,” ECN Magazine, August2010.
  28. MuAnalysis Inc., “Lumileds Luxeon K2 LED lamp teardown and technology analysis,” 2008. Available: http://www.muanalysis.com/_documents/publications/Teardown%20reports/Lumileds-Luxeon-K2-LED-Lamp-Teardown-Report-short-version.pdf .
  29. D. J. Acheson, Elementary Fluid Dynamics, Oxford Applied Mathematics and Computing Science Series (Oxford University, 1990), pp. 30–32.
  30. T. E. Faber, Fluid Dynamics for Physicists (Cambridge University, 1995), pp. 204–244.
  31. Solidworks Flow Simulation Technical Reference, 2009.
  32. T. N. Morgan, “Broadening of impurity bands in heavily doped semiconductors,” Phys. Rev. 139, A343–A348 (1965). [CrossRef]
  33. M. Ford, “In-situ LED junction temperature and thermal resistance,” Vektrex Application Note, 2008. Available: http://www.vektrex.com .
  34. J. Hulett and C. Kelly, “Measuring LED junction temperature,” Photon. Spect. 2008. Available: http://www.photonics.com/Article.aspx?AID=34316 .
  35. W. J. Hwang, T. H. Lee, L. Kim, and M. W. Shin, “Determination of junction temperature and thermal resistance in the GaN-based LEDs using direct temperature measurement,” Phys. Status Solidi C 1, 2429–2432 (2004). [CrossRef]

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