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Applied Optics

Applied Optics


  • Editor: Joseph N. Mait
  • Vol. 53, Iss. 14 — May. 10, 2014
  • pp: 3101–3109

Three-dimensional inline inspection for substrate warpage and ball grid array coplanarity using stereo vision

Takeshi Nakazawa and Ayman Samara  »View Author Affiliations

Applied Optics, Vol. 53, Issue 14, pp. 3101-3109 (2014)

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We present a method for full-field 3D measurement of substrate warpage and ball grid array coplanarity, which is suitable for inline back-end inspection and process monitoring. For evaluating the performance of the proposed system, the linearity between our system and a reference confocal microscope is studied by repeating measurements 35 times with a particular substrate sample ( 38 mm × 28.5 mm ). The point-to-point correlation coefficient with 1 σ between two methods is 0.968 ± 0.002 , and the 2 σ difference is 25.15 ± 0.20 μm for warpage measurement. 1 σ repeatability of the substrate warpage is 4.2 μm. For BGA coplanarity inspection the bump level correlation coefficient is 0.957 ± 0.001 and the 2 σ difference is 28.79 ± 0.14 μm . 1 σ repeatability of BGA coplanarity is 3.7 μm. Data acquisition takes about 0.2 s for full field measurements.

© 2014 Optical Society of America

OCIS Codes
(110.0110) Imaging systems : Imaging systems
(150.0150) Machine vision : Machine vision
(150.3040) Machine vision : Industrial inspection
(150.6910) Machine vision : Three-dimensional sensing
(150.5495) Machine vision : Process monitoring and control

ToC Category:
Machine Vision

Original Manuscript: January 30, 2014
Revised Manuscript: April 5, 2014
Manuscript Accepted: April 8, 2014
Published: May 9, 2014

Virtual Issues
Vol. 9, Iss. 7 Virtual Journal for Biomedical Optics

Takeshi Nakazawa and Ayman Samara, "Three-dimensional inline inspection for substrate warpage and ball grid array coplanarity using stereo vision," Appl. Opt. 53, 3101-3109 (2014)

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  1. W. D. Brown, Electronic Packaging (IEEE, 2006).
  2. W. J. Greig, Integrated Circuit Packaging, Assembly and Interconnections (Springer, 2007).
  3. Texas Instruments, “Flip chip ball grid array package reference guide” (2005), http://www.ti.com/lit/ug/spru811a/spru811a.pdf.
  4. H. Tsukahara, Y. Nishiyama, F. Takahashi, and T. Fuse, “High-speed solder bump inspection system using a laser scanner and CCD Camera,” Systems and Computers in Japan 31, 94–102 (2000). [CrossRef]
  5. P. Kim and S. Rhee, “Three-dimensional inspection of ball grid array using laser vision system,” IEEE Trans. Electron. Packag. Manufact. 22, 151–155 (1999). [CrossRef]
  6. H. N. Yen and D. M. Tsai, “A fast full-field 3D measurement system for BGA coplanarity inspection,” Int. J. Adv. Manuf. Technol. 24, 132–139 (2004). [CrossRef]
  7. V. Bartulovic, M. Lucic, and G. Zacek, “Inspection of ball grid arrays (BGA) by using shadow images of the solder balls,” U.S. Patent6,177,682 B1 (23January2001).
  8. D. Marr and T. Poggio, “Cooperative computation of stereo disparity,” Science 194, 283–287 (1976). [CrossRef]
  9. U. R. Dhond and J. K. Aggarwal, “Structure from stereo—a review,” IEEE Trans. Syst. Man Cybern. 19, 1489–1510 (1989). [CrossRef]
  10. M. Z. Brown, D. Burschka, and G. D. Hager, “Advances in computational stereo,” IEEE Trans. Pattern Anal. Mach. Intell. 25, 993–1008 (2003). [CrossRef]
  11. R. Y. Tsai, “A versatile camera calibration technique for high-accuracy 3D machine vision metrology using off-the-shelf TV cameras and lenses,” IEEE J. Robot. Autom. 3, 323–344 (1987). [CrossRef]
  12. Z. Zhang, “Flexible camera calibration by viewing a plane from unknown orientations,” in Proc. 7th Int. Conference on Computer Vision (IEEE, 1999), pp. 666–673.
  13. Z. Zhang, “A flexible new technique for camera calibration,” IEEE Trans. Pattern Anal. Mach. Intell. 22, 1330–1334 (2000). [CrossRef]
  14. P. Luo, Y. Chao, and M. Sutton, “Application of stereo vision to three-dimensional deformation analyses in fracture experiments,” Opt. Eng. 33, 981–990 (1994). [CrossRef]
  15. J. J. Aguilar, F. Torres, and M. A. Lope, “Stereo vision for 3D measurement: accuracy analysis, calibration and industrial applications,” Measurements 18, 193–200 (1996). [CrossRef]
  16. C. J. Tay, X. Kang, C. Quan, X. Y. He, and H. M. Shang, “Height measurement of microchip connecting pins by use of stereovision,” Appl. Opt. 42, 3827–3831 (2003). [CrossRef]
  17. Y. J. Xiao and Y. F. Li, “Optimized stereo reconstruction of free-form space curves based on a nonuniform rational B-spline model,” J. Opt. Soc. Am. A 22, 1746–1762 (2005). [CrossRef]
  18. Z. Ren and L. Cai, “Three-dimensional structure measurement of diamond crowns based on stereo vision,” Appl. Opt. 48, 5917–5932 (2009). [CrossRef]
  19. Z. Ren, J. Liao, and L. Cai, “Three-dimensional measurement of small mechanical parts under a complicated background based on stereo vision,” Appl. Opt. 49, 1789–1801 (2010). [CrossRef]
  20. Z.-Z. Tang, J. Liang, Z. Xial, C. Guo, and G. Hu, “Three-dimensional digital image correlation system for deformation measurement in experimental mechanics,” Opt. Eng. 49, 103601 (2010). [CrossRef]
  21. C. J. Tay, X. He, X. Kang, C. Quan, and H. M. Shang, “Coplanarity study on ball grid array packaging,” Opt. Eng. 40, 1608–1612 (2001). [CrossRef]
  22. M. Dong, R. Chung, E. Y. Lam, and K. S. M. Fung, “Height inspection of wafer bumps without explicit 3-D reconstruction,” IEEE Trans. Electron. Packag. Manufact. 33, 112–121 (2010). [CrossRef]
  23. C. Steger, Handbook of Machine Vision (Wiley-VCG, 2006).
  24. J. Heikkila and O. Silven, “A four-step camera calibration procedure with implicit image correction,” in Proc. Computer Vis. Patt. Recog.1106–1112 (1997).
  25. K. F. Riley, M. P. Hobson, and S. J. Bence, “Matrices and vector spaces,” in Mathematical Methods for Physics and Engineering (Cambridge University, 2002).
  26. R. Hartley, “In defense of the eight-point algorithm,” IEEE Trans. Pattern Anal. Mach. Intell. 19, 580–593 (1997). [CrossRef]
  27. R. Hartley, “Triangulation,” Comput. Vis. Image Underst. 68, 146–157 (1997). [CrossRef]

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