An argon ion laser and an ir microscope have been combined to function as a unique combination for non-destructively testing the quality of bonded connections in microcircuits of the beam lead type. A microcircuit is heated with the focused beam from the laser and scanned with the microscope to determine the temperature pattern. Nonbonded microcircuits, poorly bonded microcircuits, and a multiplicity of adjacent poorly bonded leads have been detected by using this scanner. Preliminary results have indicated that a single nonbonded connection in an array of well bonded connections may be detected. An analytical check by computer analysis demonstrates the validity of the experimental data.
© 1970 Optical Society of America
Original Manuscript: September 11, 1969
Published: March 1, 1970
B. C. Miao and J. Longfellow, "A Laser-Assisted Infrared Scanning Technique for Evaluating Bonded Connections on Beam Lead Microcircuits," Appl. Opt. 9, 669-673 (1970)