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Applied Optics

Applied Optics


  • Vol. 9, Iss. 3 — Mar. 1, 1970
  • pp: 669–673

A Laser-Assisted Infrared Scanning Technique for Evaluating Bonded Connections on Beam Lead Microcircuits

B. C. Miao and J. Longfellow  »View Author Affiliations

Applied Optics, Vol. 9, Issue 3, pp. 669-673 (1970)

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An argon ion laser and an ir microscope have been combined to function as a unique combination for non-destructively testing the quality of bonded connections in microcircuits of the beam lead type. A microcircuit is heated with the focused beam from the laser and scanned with the microscope to determine the temperature pattern. Nonbonded microcircuits, poorly bonded microcircuits, and a multiplicity of adjacent poorly bonded leads have been detected by using this scanner. Preliminary results have indicated that a single nonbonded connection in an array of well bonded connections may be detected. An analytical check by computer analysis demonstrates the validity of the experimental data.

© 1970 Optical Society of America

Original Manuscript: September 11, 1969
Published: March 1, 1970

B. C. Miao and J. Longfellow, "A Laser-Assisted Infrared Scanning Technique for Evaluating Bonded Connections on Beam Lead Microcircuits," Appl. Opt. 9, 669-673 (1970)

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