Abstract

The determination of several percent of Au, Ag, and Cu in various Sn/Pb solder compositions used in the manufacture of microelectronic circuits is described. Details of the preparation of standards and x-ray procedure are given. The Au calibration curve can be prepared from any Sn/Pb composition. The Ag and Cu calibration curves must be prepared for each solder composition.

Spectrographic Determination of Trace Elements in 70/30 Brass and Admiralty Brass. Part I*

P. A. Leichtle
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Reflection zone plate concept for resonant inelastic x-ray scattering spectrometry

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