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Chinese Optics Letters

Chinese Optics Letters

| PUBLISHED MONTHLY BY CHINESE LASER PRESS AND DISTRIBUTED BY OSA

  • Vol. 2, Iss. 11 — Nov. 10, 2004
  • pp: 654–657

Research on film thickness of conductive line formed by laser micro-fine cladding and flexibly direct writing technique

Huiling Li, Xiaoyan Zeng, Huifen Li, Xiangyou Li, and Yiqun Chen  »View Author Affiliations


Chinese Optics Letters, Vol. 2, Issue 11, pp. 654-657 (2004)


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Abstract

The conventional technology could not fulfill the rapidly growing need for fine conductive lines for its inherent limits. Therefore, in this study laser micro-fine cladding and flexibly direct writing technique is used to obtain conductive lines with high precision and reliability. In the case of different substrates and parameters, film thickness will be different. Film thickness directly influences the reliability and stability of conductive lines with exception of quality and running speed. Therefore, we focus on developing the optimal parameters for the different substrates to achieve expected film thickness and make conductive lines have good performance and quality.

© 2005 Chinese Optics Letters

OCIS Codes
(140.3510) Lasers and laser optics : Lasers, fiber
(310.1620) Thin films : Interference coatings
(350.3390) Other areas of optics : Laser materials processing

Citation
Huiling Li, Xiaoyan Zeng, Huifen Li, Xiangyou Li, and Yiqun Chen, "Research on film thickness of conductive line formed by laser micro-fine cladding and flexibly direct writing technique," Chin. Opt. Lett. 2, 654-657 (2004)
http://www.opticsinfobase.org/col/abstract.cfm?URI=col-2-11-654


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References

  1. Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).
  2. D. B Chrisey, Science 289, 879 (2000).
  3. K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).
  4. R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).
  5. H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).
  6. S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).
  7. D. Dimos, B. H. King, and P. Yang, in Proceedings of 1999 International Symposium on Advanced Packaging Materials 186 (1999).
  8. J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).
  9. H. L. Li, X. Y. Zeng, and X. Y. Li, Chin. J. Lasers (in Chinese) (to be published).
  10. X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).
  11. Q. Zhang and S. F. Jiang, Architectural Door-Window and Metal Building Materials (in Chinese) (10) 24 (2001).

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