OSA's Digital Library

Chinese Optics Letters

Chinese Optics Letters

| PUBLISHED MONTHLY BY CHINESE LASER PRESS AND DISTRIBUTED BY OSA

  • Vol. 2, Iss. 12 — Dec. 10, 2004
  • pp: 701–703

Non-contact thickness measurement for ultra-thin metal foils with differential white light interferometry

Yanli Du, Huimin Yan, Yong Wu, Xiaoqiang Yao, Yongjun Nie, and Baixuan Shi  »View Author Affiliations


Chinese Optics Letters, Vol. 2, Issue 12, pp. 701-703 (2004)


View Full Text Article

Acrobat PDF (223 KB)





Browse Journals / Lookup Meetings

Browse by Journal and Year


   


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

Share
Citations
  • Export Citation/Save Click for help

Abstract

A new differential white light interference technique for the thickness measurements of metal foil is presented. In this work, the differential white light system consists of two Michelson interferometers in tandem, and the measured reflective surfaces are the corresponding surfaces of metal foil. Therefore, the measuring result is only relative to the thickness but not the position of metal foil. The method is non-contact and non-destructive, it has the advantages of high accuracy, fast detection, and compact structure. Theoretical analysis and preliminary experimental verifications have shown that the technique can be used to measure the thickness of foil in the range of 1 to 80 ?m with accuracy better than 0.08 ?m.

© 2005 Chinese Optics Letters

OCIS Codes
(120.0120) Instrumentation, measurement, and metrology : Instrumentation, measurement, and metrology
(120.2650) Instrumentation, measurement, and metrology : Fringe analysis
(120.3180) Instrumentation, measurement, and metrology : Interferometry
(120.4290) Instrumentation, measurement, and metrology : Nondestructive testing

Citation
Yanli Du, Huimin Yan, Yong Wu, Xiaoqiang Yao, Yongjun Nie, and Baixuan Shi, "Non-contact thickness measurement for ultra-thin metal foils with differential white light interferometry," Chin. Opt. Lett. 2, 701-703 (2004)
http://www.opticsinfobase.org/col/abstract.cfm?URI=col-2-12-701


Sort:  Author  |  Year  |  Journal  |  Reset

References

  1. S. Terada, H. Murakami, and K. Nishihagi, in Proceedings of IEEE/SEMI Advanced Semiconductor Manufacturing Conference 125 (2001).
  2. J. M. De Freitas, J. S. Barton, J. D. C. Jones, A. C. Jones, M. Millington, G. Gregory, P. Spencer, I. Bain, and S. Cresswell, Proc. SPIE 4076, 152 (2000).
  3. F. Sakran, M. Golosovsky, H. Goldberger, D. Davidov, and A. Frenkel, Appl. Phys. Lett. 78, 1634 (2001).
  4. G.-H. Kim and S.-W. Kim, Proc. SPIE 3783, 239 (1999).
  5. D. K. Nayak, L. Wang, and R. Rakkhit, in IEEE Integrated Reliability Workshop, Final Report, International 160 (1996).
  6. J. Pei, F. L. Degertekin, and B. T. Khuri-Yakub, Appl. Phys. Lett. 66, 2177 (1995).
  7. I. Leizerson and S. G. Lipson, Appl. Phys. Lett. 83, 260 (2003).
  8. M. Procop, M. Radtke, M. Krumrey, K. Hasche, S. Schadlich, and W. Frank, Anal. Bioanal. Chem. 374, 631 (2002).
  9. Y. J. Rao and D. A. Jackson, Meas. Sci. Technol. 7, 981 (1996).
  10. B. Qi, G. R. Pickrell, J. C. Xu, P. Zhang, Y. H. Duan, W. Peng, Z. Y. Huang, W. Huo, H. Xiao, R. G. May, and A. Wang, Opt. Eng. 42, 3165 (2003).

Cited By

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited