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Chinese Optics Letters

Chinese Optics Letters

| PUBLISHED MONTHLY BY CHINESE LASER PRESS AND DISTRIBUTED BY OSA

  • Vol. 2, Iss. 9 — Sep. 10, 2005
  • pp: 541–542

Avoiding silicon/glass bonding damage with fusion bonding method

Daohong Yang, Chen Xu, and Guangdi Shen  »View Author Affiliations


Chinese Optics Letters, Vol. 2, Issue 9, pp. 541-542 (2005)


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Abstract

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 ?m, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.

© 2005 Chinese Optics Letters

OCIS Codes
(140.3390) Lasers and laser optics : Laser materials processing
(160.2750) Materials : Glass and other amorphous materials
(160.6000) Materials : Semiconductor materials
(220.4000) Optical design and fabrication : Microstructure fabrication

Citation
Daohong Yang, Chen Xu, and Guangdi Shen, "Avoiding silicon/glass bonding damage with fusion bonding method," Chin. Opt. Lett. 2, 541-542 (2005)
http://www.opticsinfobase.org/col/abstract.cfm?URI=col-2-9-541

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