A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 ?m, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.
© 2005 Chinese Optics Letters
(140.3390) Lasers and laser optics : Laser materials processing
(160.2750) Materials : Glass and other amorphous materials
(160.6000) Materials : Semiconductor materials
(220.4000) Optical design and fabrication : Microstructure fabrication
Daohong Yang, Chen Xu, and Guangdi Shen, "Avoiding silicon/glass bonding damage with fusion bonding method," Chin. Opt. Lett. 2, 541-542 (2005)