The reliability of microsystem is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.
© 2009 Chinese Optics Letters
G Pedrini, J. Gaspar, O. Paul, and W. Osten, "Measurement of in-plane deformations of microsystems by digital holography and speckle interferometry," Chin. Opt. Lett. 7, 1109-1112 (2009)