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Chinese Optics Letters

Chinese Optics Letters

| PUBLISHED MONTHLY BY CHINESE LASER PRESS AND DISTRIBUTED BY OSA

  • Vol. 7, Iss. 12 — Dec. 1, 2009
  • pp: 1109–1112

Measurement of in-plane deformations of microsystems by digital holography and speckle interferometry

G Pedrini, J. Gaspar, O. Paul, and W. Osten  »View Author Affiliations


Chinese Optics Letters, Vol. 7, Issue 12, pp. 1109-1112 (2009)


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Abstract

The reliability of microsystem is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.

© 2009 Chinese Optics Letters

OCIS Codes
(120.2880) Instrumentation, measurement, and metrology : Holographic interferometry
(120.3940) Instrumentation, measurement, and metrology : Metrology

Citation
G Pedrini, J. Gaspar, O. Paul, and W. Osten, "Measurement of in-plane deformations of microsystems by digital holography and speckle interferometry," Chin. Opt. Lett. 7, 1109-1112 (2009)
http://www.opticsinfobase.org/col/abstract.cfm?URI=col-7-12-1109


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References

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