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Chinese Optics Letters

Chinese Optics Letters

| PUBLISHED MONTHLY BY CHINESE LASER PRESS AND DISTRIBUTED BY OSA

  • Vol. 7, Iss. 3 — Mar. 1, 2009
  • pp: 214–216

High packing density laser diode stack arrays using Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks

Zhigang Liu, Gaozhan Fang, and Kecheng Feng  »View Author Affiliations


Chinese Optics Letters, Vol. 7, Issue 3, pp. 214-216 (2009)


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Abstract

A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks. The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 oC/W, and enables the device to be operated under continuous-wave (CW) condition at an output power of 1200 W. The thickness of the discrete copper heatsink is only 1.5 mm, which results in a high packing density and a small bar pitch of 1.8 mm.

© 2009 Chinese Optics Letters

OCIS Codes
(140.0140) Lasers and laser optics : Lasers and laser optics
(140.2010) Lasers and laser optics : Diode laser arrays

Citation
Zhigang Liu, Gaozhan Fang, and Kecheng Feng, "High packing density laser diode stack arrays using Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks," Chin. Opt. Lett. 7, 214-216 (2009)
http://www.opticsinfobase.org/col/abstract.cfm?URI=col-7-3-214

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