Abstract
Various methods for cleaning the
large glass substrates (300$\times$400 mm) used in organic light-emitting
diode (OLED)fabrication processes
were investigated. Horizontal roller-bed cleaning methods using a shower-rinse
with megasonic (MS)-irradiation, or brush-scrubbing, were investigated for
use with anode sputtering processes. Substrates were contaminated with particulate contaminants (0.3–0.5 particles/cm$^{2}$) generated
from anode sputtering targets. Large particles (${\geq}5\ \mu$m) were easily removed with
the MS irradiation (efficiency ${\geq}\hbox{95\%}$). Small particles (${<}{\hbox{3}}\mu{\hbox{m}}$) were harder to remove. The brush-scrubbing
cleaning removed them with 80–90% efficiency, while the MS-irradiation
cleaning had an efficiency of 60%–70%. Spin–rinse–dry cleaning
methods using ozonized or electrolyzed cathode water were investigated for
use with pre-organic deposition processes. Glass substrates were intentionally
contaminated by exposing them to a clean room atmosphere for either 24 or
100 hours. The number of particles was reduced from around 0.4 to 0.03/cm$^{2}$ and from around
1.7 to 0.08/cm$^{2}$ by the MS-irradiation cleaning using de-ionized water alone, respectively.
The effect of the ozonized water treatment was evident for the longer exposure
substrates: it reduced the number of particles to 0.03. The electrolyzed-cathode
water cleaning was successful in removing submicrometer size particles. We
also investigated the effect of particulate contaminants on the current leakage defect formation.
© 2009 IEEE
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