Abstract
A flexible electronics sensor for large area sensing was developed using
a screen printing technology with the thixotropy sol-gel materials to form
the microstructure patterns on two polyimide (PI) sheets. A flexible sensor
is 150$\times$150
mm$^{2}$,
including posts, resistances, bumps, and electrode traces. The space between
the top electrode and the resistance layer provided a buffer distance for
large bending. Experimental results show that array microstructures have good
morphological profiles at a screen speed of 10 mm/s, a squeegee pressure of
213 kPa, and a separation speed of 0.4 mm/s using the print–print mode.
A membrane with a bump protrusion had a large displacement and a quick sensitive
response because the bump provided a concentrated force of von Mises stress
on the membrane center. For printing thick structures, diffusion effects and
dimensional shrinkages can be reduced when a paste material with a higher
viscosity is used. The results exhibit a potential for using in the flexible
sensing and higher temperatures. In additional, the fabrication is the low
cost and potential higher throughput in flexible electronics applications.
© 2009 IEEE
PDF Article
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