In this paper, we describe the design and fabrication of 360 PPI flip-chip
mounted active matrix (AM) addressable light emitting diode on silicon (LEDoS)
micro-displays. The LEDoS micro-displays are self-emitting devices which have
higher light efficiency than liquid crystal based displays (LCDs) and longer
lifetime than organic light emitting diodes (OLEDs) based displays .
The LEDoS micro-displays were realized by integrating monolithic LED micro-arrays
and silicon-based integrated circuit using a flip-chip bonding technique.
The active matrix driving scheme was designed on the silicon to provide sufficient
driving current and individual controllability of each LED pixel. Red, green,
blue and Ultraviolet (UV) LEDoS micro-displays with a pixel size of 50
© 2013 IEEE
Zhao Jun Liu, Wing Cheung Chong, Ka Ming Wong, and Kei May Lau, "360 PPI Flip-Chip Mounted Active Matrix Addressable Light Emitting Diode on Silicon (LEDoS) Micro-Displays," J. Display Technol. 9, 678-682 (2013)