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Optica Publishing Group
  • Journal of Lightwave Technology
  • Vol. 32,
  • Issue 1,
  • pp. 115-121
  • (2014)

Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin

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Abstract

The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection module. Under four-channel simultaneous operation, the OTU4 mask margins for all four lanes of the flip-chip interconnection module exceed 37%. These values are degraded up to only 4% compared with those for single-channel operation. In addition, an error-free transmission through 10 km of single-mode fiber at 112 Gbit/s is demonstrated.

© 2013 IEEE

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