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Journal of Lightwave Technology

Journal of Lightwave Technology

| A JOINT IEEE/OSA PUBLICATION

  • Vol. 22, Iss. 9 — Sep. 1, 2004
  • pp: 2083–

MT-Compatible Laser-Ablated Interconnections for Optical Printed Circuit Boards

Geert Van Steenberge, Peter Geerinck, Steven Van Put, Jan Van Koetsem, Heidi Ottevaere, Danny Morlion, Hugo Thienpont, and Peter Van Daele

Journal of Lightwave Technology, Vol. 22, Issue 9, pp. 2083- (2004)


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Abstract

Integration of optical interconnections on a printed circuit board (PCB) is very challenging, since compatibility should be maintained with standard PCB manufacturing technology. This paper describes the use of laser ablation, a technique already used in PCB manufacturing for drilling microvias, as a suitable technique for the fabrication of multimode polymer waveguides, micromirrors, alignment features, and microlenses. A frequency-tripled Nd-YAG laser and a KrF excimer laser are used, both mounted on the same stage, resulting in very high alignment accuracies. This paper demonstrates a parallel optical link over approximately 5-cm-long PCB integrated waveguides, fully connected using a standard MT-based connector. This proves that laser ablation can be a key technology in optical board manufacturing to reach the stringent coupling tolerances.

© 2004 IEEE

Citation
Geert Van Steenberge, Peter Geerinck, Steven Van Put, Jan Van Koetsem, Heidi Ottevaere, Danny Morlion, Hugo Thienpont, and Peter Van Daele, "MT-Compatible Laser-Ablated Interconnections for Optical Printed Circuit Boards," J. Lightwave Technol. 22, 2083- (2004)
http://www.opticsinfobase.org/jlt/abstract.cfm?URI=jlt-22-9-2083

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