OSA's Digital Library

Journal of Lightwave Technology

Journal of Lightwave Technology

| A JOINT IEEE/OSA PUBLICATION

  • Vol. 22, Iss. 9 — Sep. 1, 2004
  • pp: 2128–

PCB-Compatible Optical Interconnection Using 45°-Ended Connection Rods and Via-Holed Waveguides

Byung Sup Rho, Saekyoung Kang, Han Seo Cho, Hyo-Hoon Park, Sang-Won Ha, and Byoung-Ho (Tiger) Rhee

Journal of Lightwave Technology, Vol. 22, Issue 9, pp. 2128- (2004)


View Full Text Article

Acrobat PDF (1760 KB)





Browse Journals / Lookup Meetings

Browse by Journal and Year


   


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

Share
Citations
  • Export Citation/Save Click for help

Abstract

In this paper, a new architecture for a chip-to-chip optical interconnection system is demonstrated that can be applied in a waveguide-embedded optical printed circuit board (PCB). The experiment used 45°-ended optical connection rods as a medium to guide light paths perpendicularly between vertical-cavity surface-emitting lasers (VCSELs), or photodiodes (PDs) and a waveguide. A polymer film of multimode waveguides with cores of 100 × 65 µm was sandwiched between conventional PCBs. Via holes were made with a diameter of about 140 µm by CO2-laser drilling through the PCB and the waveguide. Optical connection rods were made of a multimode silica fiber ribbon segment with a core diameter of 62.5 and 100 µm. One end of the fiber segment was cut 45° and the other end 90° by a mechanical polishing method. These fiber rods were inserted into the via holes formed in the PCB, adjusting the insertion depth to locate the 45° end of rods near the waveguide cores. From this interconnection system, a total coupling efficiency of about -8 dB was achieved between VCSELs and PDs through connection rods and a 2.5 Gb/s × 12-ch data link demonstrated through waveguides with a channel pitch of 250 µm in the optical PCB.

© 2004 IEEE

Citation
Byung Sup Rho, Saekyoung Kang, Han Seo Cho, Hyo-Hoon Park, Sang-Won Ha, and Byoung-Ho (Tiger) Rhee, "PCB-Compatible Optical Interconnection Using 45°-Ended Connection Rods and Via-Holed Waveguides," J. Lightwave Technol. 22, 2128- (2004)
http://www.opticsinfobase.org/jlt/abstract.cfm?URI=jlt-22-9-2128


Sort:  Journal  |  Reset

References

  1. N. McArdle, M. Naruse and M. Ishikawa, "Optoelectronic parallel computing using optically interconnected pipelined processing arrays", IEEE J. Select. Topics Quantum Electron., vol. 5, pp. 250-260, Mar. 1999.
  2. Y. Ishii, S. Koike, Y. Arai and Y. Ando, "SMT-compatible optical-I/O chip packaging for chip-level optical interconnects", in Proc. IEEE Electronic Components Technology Conf., 2001, pp. 870-875.
  3. D. Krabe and W. Scheel, "Optical interconnection by hot embossing for module and PCB technology-The EOCB approach", in Proc. IEEE Electronic Components Technology Conf., 1999, pp. 1164-1166.
  4. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner, J. Bristow and Y. S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects", Proc. IEEE, vol. 88, pp. 780-793, June 2000.
  5. S. Lehmacher, A. Neyer and F. Mederer, "Polymer optical waveguides integrated in printed circuit boards", in Proc. 27th Eur. Conf. Optical Communication (ECOC'01) , vol. 3, 2001, pp. 302-303.
  6. H. Schroder, J. Bauer, F. Ebling and W. Scheel, "Polymer optical interconnects for PCB polymers and adhesives in microelectronics and photonics, 2001", in Proc. 1st Int. IEEE Conf., Oct. 2001, pp. 337-343.
  7. M. Kicherer, F. Mederer, R. Jager, H. Unold, K. J. Ebeling, S. Lehmacher, A. Neyer and E. Griese, "Data transmission at 3 Gbit/s over intraboard polymer waveguides with GaAs VCSELs", in Proc. 26th Eur. Conf. Optical Communication (ECOC'01), vol. 3, 2000, pp. 289-290.
  8. E. Griese, "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Trans. Adv. Packag., vol. 24, pp. 373-383, Aug. 2001 .
  9. B. S. Rho, J. Y. Eo, S. K. Kang, H.-H. Park, Y. W. Kim, Y. S. Joe and D. J. Yang, "New architecture of optical interconnection using 45° -ended connection rods in waveguide-embedded printed circuit boards", in Proc. SPIE , vol. 4997, 2003, pp. 71-78.
  10. H. S. Cho, K. M. Chu, S. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim and H.-H. Park, "Compact packaging of optical and electronic components for on-board optical interconnects", IEEE Trans. Adv. Packag., to be published.
  11. E. M. Strzelecka, D. A. Louderback, K. Bertilsson, B. J. Thibeault, M. Mondry and L. A. Coldren, "Free-space optical link realized with microlensed component", in Proc. Electronic Components Technology Conf., 1997, pp. 376-381.

Cited By

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited