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Optica Publishing Group
  • Journal of Lightwave Technology
  • Vol. 24,
  • Issue 2,
  • pp. 956-
  • (2006)

Facet-Passivation Processes for the Improvement of Al-Containing Semiconductor Laser Diodes

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Abstract

The passivation requirements for high-power 980-nm and mid-power 780-nm quantum-well (QW) ridge-waveguide (RWG) Al-containing laser diodes cleaved in air were investigated. In a direct comparison with argon ablation, sulphation, and silicon-barrier-passivation techniques, nitrided facets with a silicon nitride barrier layer exhibited up to an order of magnitude improvement in device lifetime over the next-best method during highly accelerated testing while also maintaining high catastrophic optical damage (COD) or catastrophic optical mirror damage (COMD) thresholds. Well-oxidized facets of 980-nm devices exposed to air for six months were recovered with this process to give reasonable lifetimes (5.66 × 10<sup>-5</sup> h<sup>-1</sup> power degradation) during highly accelerated testing.

© 2006 IEEE

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