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Journal of Lightwave Technology

Journal of Lightwave Technology

| A JOINT IEEE/OSA PUBLICATION

  • Vol. 26, Iss. 2 — Jan. 15, 2008
  • pp: 243–250

Fully Embedded Board-Level Optical Interconnects From Waveguide Fabrication to Device Integration

Xiaolong Wang, Wei Jiang, Li Wang, Hai Bi, and Ray T. Chen

Journal of Lightwave Technology, Vol. 26, Issue 2, pp. 243-250 (2008)


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Abstract

This paper presents the latest progress toward fully embedded board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45° micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide propagation loss is reduced to 0.09 dB/cm. The coupling efficiency of the metal-coated reflecting mirror, which is embedded in the thin-film waveguide, is simulated by an M2 factor revised Gaussian beam method and is experimentally measured to be 85%. The active optoelectronic devices, vertical surface emitter lasers and p-i-n photodiodes, are integrated with the mirror-ended waveguide array and successfully demonstrate a 10 Gbps signal transmission over the embeddable optical layer.

© 2008 IEEE

Citation
Xiaolong Wang, Wei Jiang, Li Wang, Hai Bi, and Ray T. Chen, "Fully Embedded Board-Level Optical Interconnects From Waveguide Fabrication to Device Integration," J. Lightwave Technol. 26, 243-250 (2008)
http://www.opticsinfobase.org/jlt/abstract.cfm?URI=jlt-26-2-243

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