Abstract
A new integration technique of a 45-degree micromirror providing a vertical
coupling between a free-space wave and a guided wave in a dielectric-glass waveguide for
high-density intra-board optical interconnection was described. A planar waveguide
consisting of a 4-μm-thickness GeO<sub>2</sub>:SiO<sub>2</sub> guiding core layer
and a 2-μm-thickness SiO<sub>2</sub> cladding layer on an SiO<sub>2</sub>
substrate was used for characterization of the micromirror. A trench with 8-μm
depth and 8-μm width was formed in the waveguide by using a dry etching
technique. A photoresist filling the trench was exposed at an angle of 45 degrees in the
water to give a 45-degree taper in the trench. Au was evaporated on the taper to give
high-reflection micromirror. An excess loss due to the micromirror insertion was
estimated to be about 2 dB by comparing insertion losses of waveguides with and without
the micromirror.
© 2012 IEEE
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