Abstract
In this paper, the influence of packaging-induced RF signal degradation
on an optoelectronic modulator module is investigated. A directly modulated
laser (DML) is modeled and packaged in a butterfly-type package. A distributed
3-D electromagnetic model is built based on this laser module. In the packaging
assembly procedure, impedance mismatching and ground discontinuity on microwave
transmission will cause unwanted signal decays and resonances. We specify
the RF degradation in three regions: 1) the RF connector, 2) the RF substrate,
and 3) the mode transition region between the optoelectronic subsystem and
the package. The RF transmission characteristics in these regions are extracted
and analyzed in detail. The results indicate that by optimizing the packaging
design, strong resonances and signal decays can be eliminated or compensated
over a wide frequency range. The measured scattering parameters show that
the proposed packaging assembly has a resonance-free bandwidth of 31.2 GHz,
and the DML module exhibits a wide 3 dB bandwidth of 15.1
GHz.
© 2012 IEEE
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