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Journal of Lightwave Technology

Journal of Lightwave Technology

| A JOINT IEEE/OSA PUBLICATION

  • Vol. 32, Iss. 1 — Jan. 1, 2014
  • pp: 115–121

Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin

Shigeru Kanazawa, Takeshi Fujisawa, Nobuhiro Nunoya, Akira Ohki, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, and Hiroyuki Ishii

Journal of Lightwave Technology, Vol. 32, Issue 1, pp. 115-121 (2014)


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Abstract

The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection module. Under four-channel simultaneous operation, the OTU4 mask margins for all four lanes of the flip-chip interconnection module exceed 37%. These values are degraded up to only 4% compared with those for single-channel operation. In addition, an error-free transmission through 10 km of single-mode fiber at 112 Gbit/s is demonstrated.

© 2013 IEEE

Citation
Shigeru Kanazawa, Takeshi Fujisawa, Nobuhiro Nunoya, Akira Ohki, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, and Hiroyuki Ishii, "Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin," J. Lightwave Technol. 32, 115-121 (2014)
http://www.opticsinfobase.org/jlt/abstract.cfm?URI=jlt-32-1-115

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