OSA's Digital Library

Journal of Lightwave Technology

Journal of Lightwave Technology

| A JOINT IEEE/OSA PUBLICATION

  • Vol. 32, Iss. 6 — Mar. 15, 2014
  • pp: 1207–1212

High-Bandwidth Density and Low-Power Optical MCM Using Waveguide-Integrated Organic Substrate

Masao Tokunari, Hsiang-Han Hsu, Kazushige Toriyama, Hirokazu Noma, and Shigeru Nakagawa

Journal of Lightwave Technology, Vol. 32, Issue 6, pp. 1207-1212 (2014)


View Full Text Article

Acrobat PDF (633 KB)





Browse Journals / Lookup Meetings

Browse by Journal and Year


   


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools

Share
Citations
  • Export Citation/Save Click for help

Abstract

A high-bandwidth density and low-power optical multichip module (MCM) is developed and demonstrated. The module includes bare optical and driver chips and an application specific integrated circuit bonded on an optical waveguide-integrated organic carrier. Characterization results show that the optical I/O operates up to 20 Gb/s. The high-speed performance is not limited by the electrical characteristics of the carrier but by the optical chip bandwidth. The space between the VCSEL/PD surface and the waveguide is minimized to less than 5 μm by using an assembly technology with chip height control, which results in an average insertion loss of 2.7 dB. Alignment tolerances for a 0.5 dB insertion loss increase are ±5 and 7 μm for the transmitter, and ±6 and 7 μm for the receiver in the parallel and perpendicular directions respectively. This type of organic optical MCM promises to integrate high-bandwidth density and low-power optical I/Os with CMOS ICs on first level packages for next generation high performance computers and servers.

© 2013 IEEE

Citation
Masao Tokunari, Hsiang-Han Hsu, Kazushige Toriyama, Hirokazu Noma, and Shigeru Nakagawa, "High-Bandwidth Density and Low-Power Optical MCM Using Waveguide-Integrated Organic Substrate," J. Lightwave Technol. 32, 1207-1212 (2014)
http://www.opticsinfobase.org/jlt/abstract.cfm?URI=jlt-32-6-1207


Sort:  Year  |  Journal  |  Reset

References

  1. TOP500. [Online]. Available: http://www.top500.org/.
  2. S. Nakagawa, "1.5 mW/Gbps low power optical interconnect transmitter exploiting high-efficiency VCSEL and CMOS driver," Tech Dig Optical Fiber Communication Conf. presented at theSan DiegoCAUSA (2008).
  3. SNAP12. (2005, Dec.). [Online]. Available: http://www.avagotech.co.jp/docs/5989–4524EN.
  4. Roadrunner. (2008). [Online]. Available: http://www.lanl.gov/roadrunner/.
  5. Power 775. (2011, Aug.). [Online]. Available: http://209.240.136.95/ Hardware/IBM-Power-Systems/PDFs/IBM-Power-775-Server.PDF .
  6. A. F. Benner, "Optics for high-performance servers and supercomputers," Tech Dig Optical Fiber Communication Conf. presented at theSan DiegoCAUSA ( 2010, Paper OTuH1).
  7. M. H. Fields, "Transceivers and optical engines for computer and datacenter interconnects," Proc. Tech Dig Optical Fiber Communication Conf. presented at theSan DiegoCAUSA (2010, Paper OTuP1).
  8. F. E. Doany, "Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers," J. Lightw. Technol. 30 , 560-571 (2012).
  9. X. Lin, A. Hosseini, X. Dou, H. Subbaraman, R. T. Chen, "Low-cost board-to-board optical interconnects using molded polymer waveguide with 45 degree mirrors and inkjet-printed micro-lenses as proximity vertical coupler," Opt. Exp. 21, 60-69 ( 2013).
  10. Y. Taira, "OE device integration for optically enabled MCM," Proc 57th Electron. Components Technol. Conf (2007) pp. 1262-1267.

Cited By

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited