15 February 2015, Volume 33, Issue 4, pp. 725-954  
30 articles

Guest Editorial Optical Interconnects

J. Lightwave Technol. 33(4), 725-726 (2015)  View: PDF

VCSEL-Based Interconnects for Current and Future Data Centers

J. Lightwave Technol. 33(4), 727-732 (2015)  View: PDF

Energy-Efficient 1060-nm Optical Link Operating up to 28 Gb/s

J. Lightwave Technol. 33(4), 733-740 (2015)  View: PDF

Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides

open access J. Lightwave Technol. 33(4), 741-754 (2015)  View: PDF

Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding

J. Lightwave Technol. 33(4), 755-760 (2015)  View: PDF

Single-Channel 50G and 100G Discrete Multitone Transmission With 25G VCSEL Technology

J. Lightwave Technol. 33(4), 761-767 (2015)  View: PDF

Silicon Photonic Switch Fabrics in Computer Communications Systems

J. Lightwave Technol. 33(4), 768-777 (2015)  View: PDF

A 30-Gb/s 1.37-pJ/b CMOS Receiver for Optical Interconnects

J. Lightwave Technol. 33(4), 778-786 (2015)  View: PDF

High-Speed Direct-Modulated Unidirectional Emission Square Microlasers

J. Lightwave Technol. 33(4), 787-794 (2015)  View: PDF

Impact of Damping on High-Speed Large Signal VCSEL Dynamics

J. Lightwave Technol. 33(4), 795-801 (2015)  View: PDF

A 50 Gb/s NRZ Modulated 850 nm VCSEL Transmitter Operating Error Free to 90 °C

J. Lightwave Technol. 33(4), 802-810 (2015)  View: PDF

Parallel Optical Interconnects Submodule Using Silicon Optical Bench

J. Lightwave Technol. 33(4), 811-813 (2015)  View: PDF

Thermally Stable, Low Loss Optical Silicones: A Key Enabler for Electro-Optical Printed Circuit Boards

J. Lightwave Technol. 33(4), 814-819 (2015)  View: PDF

High-Responsivity Low-Voltage 28-Gb/s Ge p-i-n Photodetector With Silicon Contacts

J. Lightwave Technol. 33(4), 820-824 (2015)  View: PDF

Impact of the Oxide-Aperture Diameter on the Energy Efficiency, Bandwidth, and Temperature Stability of 980-nm VCSELs

J. Lightwave Technol. 33(4), 825-831 (2015)  View: PDF

All Colorless FPLD-Based Bidirectional Full-Duplex DWDM-PON

J. Lightwave Technol. 33(4), 832-842 (2015)  View: PDF

160-Gb/s Silicon All-Optical Packet Switch for Buffer-less Optical Burst Switching

J. Lightwave Technol. 33(4), 843-848 (2015)  View: PDF

4 × 4 Nonblocking Silicon Thermo-Optic Switches Based on Multimode Interferometers

J. Lightwave Technol. 33(4), 857-864 (2015)  View: PDF

High-Precision, Self-Aligned, Optical Fiber Connectivity Solution for Single-Mode Waveguides Embedded in Optical PCBs

J. Lightwave Technol. 33(4), 865-871 (2015)  View: PDF

Optical Cables for Consumer Applications

J. Lightwave Technol. 33(4), 872-877 (2015)  View: PDF

High-Speed Fabry–Pérot Optical Modulator in Silicon With 3-μm Diode

J. Lightwave Technol. 33(4), 878-881 (2015)  View: PDF

40 Gb/s Data Transmission Over a 1-m-Long Multimode Polymer Spiral Waveguide for Board-Level Optical Interconnects

open access J. Lightwave Technol. 33(4), 882-888 (2015)  View: PDF

Energy-Efficient Photonics in Future High-Connectivity Computing Systems

J. Lightwave Technol. 33(4), 889-900 (2015)  View: PDF

Multilayer Silicon Nitride-on-Silicon Integrated Photonic Platforms and Devices

J. Lightwave Technol. 33(4), 901-910 (2015)  View: PDF

A Scalable, Low-Latency, High-Throughput, Optical Interconnect Architecture Based on Arrayed Waveguide Grating Routers

J. Lightwave Technol. 33(4), 911-920 (2015)  View: PDF

Dynamic Analysis of High-Efficiency InP-Based Photodiode for 40 Gbit/s Optical Interconnect Across a Wide Optical Window (0.85 to 1.55 μm)

J. Lightwave Technol. 33(4), 921-927 (2015)  View: PDF

Silicon Photonics for Advanced Optical Interconnections

J. Lightwave Technol. 33(4), 928-933 (2015)  View: PDF

Experimental and Numerical Study of Electrical Crosstalk in Photonic-Integrated Circuits

J. Lightwave Technol. 33(4), 934-942 (2015)  View: PDF

Multi-100 GbE and 400 GbE Interfaces for Intra-Data Center Networks Based on Arrayed Transceivers With Serial 100 Gb/s Operation

J. Lightwave Technol. 33(4), 943-954 (2015)  View: PDF