Journal of Optical Communications and Networking Feature Announcement
Optics in the Data Center
Submission Deadline: 15 January 2011
Performance gains in computer systems are increasingly achieved through interconnecting large numbers of parallel processor nodes. The resulting demands on communication bandwidth are extremely challenging, with the computer backplane or the switch/router backplane looming as one of the primary bottlenecks to information transfer. Within the next decade, Exaflop-scale machines will be produced that incorporate well over 1 million optical interconnects. Traditional Datacom transceiver technology is too costly, bulky, and power hungry to support this scale of deployment. A new class of optimized short-reach, low-power and low-cost optical interconnect must therefore be developed to enable next-generation large-scale systems.
From the application side, web services, virtualization and cloud computing are significantly changing the function and scale of the data center. How will this change of scale be reflected in the architecture and interconnection network in the data center? What new capabilities will the advent of optics into the network enable?
This issue will explore how recent advances in data center system design and enabling optical interconnection technologies (e.g. nanoscale silicon photonic technologies) that will, in concert, address the critical bandwidth and power challenges presented across several levels of the computing system interconnect.
The Journal of Optical Communications and Networking (JOCN) is soliciting papers for a Feature Issue addressing all aspects of enabling technologies, architectures, and systems design concerning optics in the data center. The aim of this feature issue is to publish original research on topics including, but not limited to the following:
- Novel optical network architectures
- Requirements for future systems
- Capabilities and issues for scaling to exaflop computing
- Emerging technologies
- Energy efficient interconnects; green optical interconnects
- Integration, high volume manufacturing, packaging for photonics device/modules
Manuscripts must be prepared according to the usual standards for submission to JOCN; see the Information for Contributors in any printed issue or the OSA author guidelines: http://www.opticsinfobase.org/jocn/journal/jocn/author.cfm. Manuscripts must also be uploaded through OSA's electronic submission system: http://www.opticsinfobase.org/JOCN/adsonline/default.cfm?event=author.start. Please specify that the manuscript is for the Optics in the Data Center feature (choose from the feature issue drop-down menu).
Feature Editors
Madeleine Glick
Intel Labs
Pittsburgh, Pennsylvania
USA
madeleine.glick@intel.com
Ashok V. Krishnamoorthy
Oracle Corporation
San Diego, California
USA
ashok.krishnamoorthy@oracle.com
Clint Schow
IBM
Yorktown Heights, New York
USA
cschow@us.ibm.com
