The dielectric properties of Ag–Cu alloy films prepared by direct current magnetron sputtering were studied using variable angle spectroscopy ellipsometry. The dissipate loss of Ag–Cu alloy films was increased in the short wavelength (300–450 nm) with the increase of copper addition in silver alloys. The effective medium theory model was employed to characterize the surface roughness layer in the data simulation. Two typical peaks around 1.7 and 3.2 eV were presented for Ag–Cu alloys. The dielectric functions can be manipulated by the change of alloy composition and annealing temperature.
© 2013 Optical Society of America
Original Manuscript: September 6, 2012
Revised Manuscript: October 25, 2012
Manuscript Accepted: December 2, 2012
Published: January 7, 2013
Guang Yang, Xiaojian Fu, and Ji Zhou, "Dielectric properties of the silver–copper alloy films deposited by magnetron sputtering," J. Opt. Soc. Am. B 30, 282-287 (2013)