Abstract

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having <TEX>$230{\mu}m$</TEX> sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

© 2006 Optical Society of Korea

Fabrication of microoptical freeform arrays on wafer level for imaging applications

Jens Dunkel, Frank Wippermann, Andreas Reimann, Andreas Brückner, and Andreas Bräuer
Opt. Express 23(25) 31915-31925 (2015)

Optical Cluster Eye fabricated on wafer-level

Julia Meyer, Andreas Brückner, Robert Leitel, Peter Dannberg, Andreas Bräuer, and Andreas Tünnermann
Opt. Express 19(18) 17506-17519 (2011)

Sub-wavelength gratings fabricated on a light bar by roll-to-roll UV embossing process

Chun-Wei Liu, Chi-Hung Lee, and Shih-Chieh Lin
Opt. Express 19(12) 11299-11311 (2011)

Fast fabrication of integrated surface-relief and particle-diffusing plastic diffuser by use of a hybrid extrusion roller embossing process

Tzu-Chien Huang, Jian-Ren Ciou, Po-Hsun Huang, Kuo-Huang Hsieh, and Sen-Yeu Yang
Opt. Express 16(1) 440-447 (2008)

Fabrication of large area resin microlens arrays using gas-assisted ultraviolet embossing

Po-Hsun Huang, Tzu-Chien Huang, Yi-Ting Sun, and Sen-Yeu Yang
Opt. Express 16(5) 3041-3048 (2008)