Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process
Journal of the Optical Society of Korea, Vol. 10, Issue 3, pp. 124-129 (2006)
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Abstract
We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having <TEX>$230{\mu}m$</TEX> sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.
© 2006 Optical Society of Korea
OCIS Codes
(160.4670) Materials : Optical materials
(220.3630) Optical design and fabrication : Lenses
(220.4610) Optical design and fabrication : Optical fabrication
History
Original Manuscript: August 29, 2006
Revised Manuscript: September 25, 2006
Published: September 25, 2006
Citation
Ho-Seop Jeong, Sung-Hwa Kim, Dong-Ik Shin, Seok-Cheon Lee, Young-Su Jin, Jung-Eun Noh, Hye-Ran Oh, Ki-Un Lee, Seok-Ho Song, and Woo-Je Park, "Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process," J. Opt. Soc. Korea 10, 124-129 (2006)
http://www.opticsinfobase.org/josk/abstract.cfm?URI=josk-10-3-124
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References
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