We present a very simple and efficient bare-wafer inspection method using a knife-edge test. The wafer front surface and inner structures are inspected simultaneously. The wafer front surface is inspected visually using a knife-edge test while the inner structure is simultaneously inspected by a camera in the infrared region with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

© 2007 Optical Society of Korea

1. Paul Sandland, Curt H. Chadwick, Russell M. Singleton, Sunnyvale, and Howard Dwyer, "Method and apparatus for automatic wafer inspection," US Patent, No. 4,618, 938, 1986
2. Lawrence H. Lin, Victor A. Scheff, and Alameda, "Inspection system with in-lens off-axis illuminator", US patent, No. 5,428,442, 1995
3. Michael E. Fossey and John C. Stover, "Wafer inspection system for distinguishing pits and particles," US patent, No. 6,292,259, 2001
4. Jhon R. Jordan, Mehrdad Nikoonahad, and Keith B. Wells,"Surface inspection system," US Patent, No. 5,864,394, 1999
5. Christopher R Fairley, Yao-Yi Fu, Gershon Perelman, and Bin-Ming Benjamin Tsai, "High throughput brightfield/ darkfield wafer inspection system using advanced optical techniques," US patent, No. 6,288,780, 2001
6. Yukiko Nakashige and Tadashi Nishioka, "Semiconductor wafer inspection apparatus," US Patent, No. 5,465,145, 1995
7. Dong-Guk Kim, Seung-Bae Chung, and Ki-kweon Chung, "Method and apparatus of wafer backside inspection," Korea Patent, No. 10-0445457, 2004
8. Tae-yueol Hu, Kyu-cheol Cho, Kyung-rim Kang, and Soo-yeol Choi, "Wafer surface inspection method," Korea Patent, No. 10-0327340, 2002
9. Yeon-Han Bae, "Wafer inspection apparatus," Korea Patent, No. 10-0478482, 2005
10. Da Meisberget, etc, "Electron beam inspection system and method," US patent, No. 5,578,821, 1996
11. Daniel Malacara, "Optical Shop Testing," Chap. 8, pp. 265-320, 1991
12. Yasuyuki Ishii, Akira Isoya, Takuji Kojima, and Kazuo Arakawa, "Estimation of keV submicron ion beam width using a knife-edge method," Nuclear instruments and methods in physics research B 211, pp. 415-424, 2003 [CrossRef]

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

• Yasuyuki Ishii, Akira Isoya, Takuji Kojima, and Kazuo Arakawa, "Estimation of keV submicron ion beam width using a knife-edge method," Nuclear instruments and methods in physics research B 211, pp. 415-424, 2003 [CrossRef]

Other

• Paul Sandland, Curt H. Chadwick, Russell M. Singleton, Sunnyvale, and Howard Dwyer, "Method and apparatus for automatic wafer inspection," US Patent, No. 4,618, 938, 1986
• Lawrence H. Lin, Victor A. Scheff, and Alameda, "Inspection system with in-lens off-axis illuminator", US patent, No. 5,428,442, 1995
• Michael E. Fossey and John C. Stover, "Wafer inspection system for distinguishing pits and particles," US patent, No. 6,292,259, 2001
• Jhon R. Jordan, Mehrdad Nikoonahad, and Keith B. Wells,"Surface inspection system," US Patent, No. 5,864,394, 1999
• Christopher R Fairley, Yao-Yi Fu, Gershon Perelman, and Bin-Ming Benjamin Tsai, "High throughput brightfield/ darkfield wafer inspection system using advanced optical techniques," US patent, No. 6,288,780, 2001
• Yukiko Nakashige and Tadashi Nishioka, "Semiconductor wafer inspection apparatus," US Patent, No. 5,465,145, 1995
• Dong-Guk Kim, Seung-Bae Chung, and Ki-kweon Chung, "Method and apparatus of wafer backside inspection," Korea Patent, No. 10-0445457, 2004
• Tae-yueol Hu, Kyu-cheol Cho, Kyung-rim Kang, and Soo-yeol Choi, "Wafer surface inspection method," Korea Patent, No. 10-0327340, 2002
• Yeon-Han Bae, "Wafer inspection apparatus," Korea Patent, No. 10-0478482, 2005
• Da Meisberget, etc, "Electron beam inspection system and method," US patent, No. 5,578,821, 1996
• Daniel Malacara, "Optical Shop Testing," Chap. 8, pp. 265-320, 1991

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