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Journal of the Optical Society of Korea

Journal of the Optical Society of Korea

| PUBLISHED BY THE OPTICAL SOCIETY OF KOREA

  • Vol. 11, Iss. 4 — Dec. 25, 2007
  • pp: 173–176

Bare Wafer Inspection using a Knife-edge Test

Jun-Ho Lee, Yong-Min Kim, Jin-Seob Kim, and Yeong-Eun Yoo  »View Author Affiliations


Journal of the Optical Society of Korea, Vol. 11, Issue 4, pp. 173-176 (2007)


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Abstract

We present a very simple and efficient bare-wafer inspection method using a knife-edge test. The wafer front surface and inner structures are inspected simultaneously. The wafer front surface is inspected visually using a knife-edge test while the inner structure is simultaneously inspected by a camera in the infrared region with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

© 2007 Optical Society of Korea

OCIS Codes
(080.0080) Geometric optics : Geometric optics
(120.4630) Instrumentation, measurement, and metrology : Optical inspection
(120.6650) Instrumentation, measurement, and metrology : Surface measurements, figure
(220.4840) Optical design and fabrication : Testing

History
Original Manuscript: August 31, 2007
Revised Manuscript: October 17, 2007
Published: December 25, 2007

Citation
Jun-Ho Lee, Yong-Min Kim, Jin-Seob Kim, and Yeong-Eun Yoo, "Bare Wafer Inspection using a Knife-edge Test," J. Opt. Soc. Korea 11, 173-176 (2007)
http://www.opticsinfobase.org/josk/abstract.cfm?URI=josk-11-4-173


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References

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