OSA's Digital Library

Journal of Optical Technology

Journal of Optical Technology


  • Vol. 80, Iss. 12 — Dec. 1, 2013
  • pp: 751–755

Increasing the light-output efficiency from chip-on-board LED modules

S. N. Lipnitskaya, V. E. Bugrov, A. R. Kovsh, M. A. Odnoblyudov, K. D. Mynbaev, L. A. Nikulina, and A. E. Romanov  »View Author Affiliations

Journal of Optical Technology, Vol. 80, Issue 12, pp. 751-755 (2013)

View Full Text Article

Acrobat PDF (763 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



This paper discusses the design optimization of LEDs fabricated using chip-on-board technology. Light losses are analyzed, and an attempt is made to create an optical element that maximizes the light-output efficiency from the chips. Experimental measurements of test samples are made, and optimization calculations are carried out using the Zemax software package. As a result of the studies, an optimized shape of the optical element is obtained that makes it possible to reduce the light losses in the device by 10% by comparison with the initial design.

© 2014 Optical Society of America

OCIS Codes
(230.3670) Optical devices : Light-emitting diodes
(290.5880) Scattering : Scattering, rough surfaces
(080.2205) Geometric optics : Fabrication, injection molding
(080.2468) Geometric optics : First-order optics

Original Manuscript: April 29, 2013
Published: February 18, 2014

S. N. Lipnitskaya, V. E. Bugrov, A. R. Kovsh, M. A. Odnoblyudov, K. D. Mynbaev, L. A. Nikulina, and A. E. Romanov, "Increasing the light-output efficiency from chip-on-board LED modules," J. Opt. Technol. 80, 751-755 (2013)

Sort:  Author  |  Year  |  Journal  |  Reset


  1. O.  Kückmann, “High-power LED arrays special requirements on packaging technology,” Proc. SPIE 6134, 613404 (2006). [CrossRef]
  2. P.  Hartmann, F. P.  Wenzl, C.  Sommer, P.  Pachler, H.  Hoschopf, M.  Schweighart, M.  Hartmann, L.  Kuna, G.  Jakopic, G.  Leising, S.  Tasch, “White LEDs and modules in chip-on-board technology for general lighting,” Proc. SPIE 6337, 63370I (2006). [CrossRef]
  3. A. I.  Zhmakin, “Enhancement of light extraction from light-emitting diodes,” Phys. Rep. 498, 189 (2011). [CrossRef]
  4. Y.-K.  Ee, P.  Kumnorkaew, R. A.  Arif, H.  Tong, H.  Zhao, J. F.  Gilchrist, N.  Tansu, “Optimization of light-extraction efficiency of III-nitride LEDs with self-assembled colloidal-based microlenses,” IEEE J. Sel. Topics Quantum Electron. 15, 1218 (2009).
  5. K.  Bao, B.  Zhang, X. N.  Kang, T.  Dai, C.  Xiong, G. Y.  Zhang, Y.  Chen, “Improvement of light extraction from micro-pattern encapsulated GaN-based LED by imprinting,” Proc. SPIE 6910, 69100N (2008). [CrossRef]
  6. S. A.  Joo, J. K.  Park, K. Y.  Ko, Y. J.  Jeong, S. H.  Choi, “Light-emitting diode package,” U.S. patent8 168 997 (2012).
  7. X.  Tao, “Surface-textured encapsulations for use with light-emitting diodes,” U.S. patent application publication 2011/0316006 (2011).
  8. O. E.  Kruglov, V. N.  Kuz’min, K. A.  Tomskiĭ, “Measurement of the light flux of LEDs,” Svetotekhnika No. 3, 34 (2009).
  9. L.  Szirmay-Kalos, Monte-Carlo Methods in Global Illumination (Institute of Computer Graphics, Vienna, 2000).
  10. Zemax User’s Manual, January2012.

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited