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Demonstration of 12.5-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate

Yutaka Urino, Yoshiji Noguchi, Masataka Noguchi, Masahiko Imai, Masashi Yamagishi, Shigeru Saitou, Naoki Hirayama, Masashi Takahashi, Hiroyuki Takahashi, Emiko Saito, Makoto Okano, Takanori Shimizu, Nobuaki Hatori, Masashige Ishizaka, Tsuyoshi Yamamoto, Takeshi Baba, Takeshi Akagawa, Suguru Akiyama, Tatsuya Usuki, Daisuke Okamoto, Makoto Miura, Junichi Fujikata, Daisuke Shimura, Hideaki Okayama, Hiroki Yaegashi, Tai Tsuchizawa, Koji Yamada, Masahiko Mori, Tsuyoshi Horikawa, Takahiro Nakamura, et al.

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Abstract

One of the most serious issues in information industries is the bandwidth bottleneck in inter-chip interconnects. We propose a photonics-electronics convergence system to solve this issue. We fabricated a high density optical interposer to demonstrate the feasibility of the system by using silicon photonics integrated with an arrayed laser diode, an optical splitter, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on a single silicon substrate. Error-free data transmission at 12.5 Gbps and a transmission density of 6.6 Tbps/cm2 were achieved with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.

©2012 Optical Society of America

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Figures (8)
Fig. 1
Fig. 1 Conceptual model of photonics-electronics convergence system for inter-chip interconnects.

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Fig. 2
Fig. 2 Structure and images of optical modulator.

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Fig. 3
Fig. 3 DC response of optical modulator.

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Fig. 4
Fig. 4 Structure and images of MSM-PD.

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Fig. 5
Fig. 5 Frequency responses of PDs.

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Fig. 6
Fig. 6 Schematic structure of trident SSC and SEM image.

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Fig. 7
Fig. 7 Photograph of fabricated silicon optical interposer.

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Fig. 8
Fig. 8 Results from data transmission experiments.

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Tables (2)

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Table 1 Optical power budget

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Table 2 Footprints of optical components per channel

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