OSA's Digital Library

Optics Express

Optics Express

  • Editor: Michael Duncan
  • Vol. 12, Iss. 8 — Apr. 19, 2004
  • pp: 1753–1758

Thermal oxide based silica ridge waveguide technology

D.W. Zheng, J. Fong, Z. Shao, Y. Lian, and C. Wu  »View Author Affiliations

Optics Express, Vol. 12, Issue 8, pp. 1753-1758 (2004)

View Full Text Article

Enhanced HTML    Acrobat PDF (378 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



A silica planar waveguide structure, where a ridge waveguide resides on a vacuum gap, was invented. The silica layer, which was fabricated through thermal oxidation at 1150 °C, had an excellent optical index uniformity on the order of 3×10-5 @1550 nm, and a thickness uniformity of 10 nm at a thickness of 10 µm. Straight waveguide with low insertion loss was demonstrated. Improved thermal efficiency of this structure to cause phase change was discussed in comparison to the conventional channel waveguide structure. Finally, the limitation of this technology to make complex device structures was also explored.

© 2004 Optical Society of America

OCIS Codes
(130.1750) Integrated optics : Components
(130.3120) Integrated optics : Integrated optics devices
(130.3130) Integrated optics : Integrated optics materials

ToC Category:
Research Papers

Original Manuscript: February 23, 2004
Revised Manuscript: April 7, 2004
Published: April 19, 2004

D. Zheng, J. Fong, Z. Shao, Y. Lian, and C. Wu, "Thermal oxide based silica ridge waveguide," Opt. Express 12, 1753-1758 (2004)

Sort:  Journal  |  Reset  


  1. K. Okamoto, �??PLC Technologies: present and future,�?? in Proc. SPIE 4532, 86-92 ( 2001). [CrossRef]
  2. B.R. Singh, �??Silica based planar lightwave circuits on silicon platform,�?? in Proc. SPIE 3975, 319-326 (2000).
  3. Y.P. Li, and C.H. Henry, �??Silica-based integrated circuits,�?? IEE Proc. Optoelectronics 143, 263-280 (1996). [CrossRef]
  4. M. Kawachi, �??Recent progress in silica-based planar lightwave circuits on silicon,�?? IEE Proc. Optoelectronics 143, 257-262(1996). [CrossRef]
  5. Q.-Y. Tong, U. Gösele, Semiconductor wafer bonding: science and technology (John Wiley, New York, 1999).

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.


Fig. 1. Fig. 2. Fig. 3.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited