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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 16, Iss. 11 — May. 26, 2008
  • pp: 8077–8083

Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards

S. H. Hwang, W.-J. Lee, J. W. Lim, K. Y. Jung, K. S. Cha, and B. S. Rho  »View Author Affiliations


Optics Express, Vol. 16, Issue 11, pp. 8077-8083 (2008)
http://dx.doi.org/10.1364/OE.16.008077


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Abstract

A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45°-ended optical waveguide embedded in the RFOE-PCB.

© 2008 Optical Society of America

OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(220.4610) Optical design and fabrication : Optical fabrication
(250.3140) Optoelectronics : Integrated optoelectronic circuits

ToC Category:
Optoelectronics

History
Original Manuscript: February 6, 2008
Revised Manuscript: May 9, 2008
Manuscript Accepted: May 13, 2008
Published: May 20, 2008

Citation
S. H. Hwang, W. J. Lee, J. W. Lim, K. Y. Jung, K. S. Cha, and B. S. Rho, "Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards," Opt. Express 16, 8077-8083 (2008)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-16-11-8077


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