OSA's Digital Library

Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 19, Iss. 19 — Sep. 12, 2011
  • pp: 18020–18028

Si-photonics based passive device packaging and module performance

Jeong Hwan Song, Jing Zhang, Huijuan Zhang, Chao Li, and Guo Qiang Lo  »View Author Affiliations

Optics Express, Vol. 19, Issue 19, pp. 18020-18028 (2011)

View Full Text Article

Enhanced HTML    Acrobat PDF (2067 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



We report a fully packaged silicon passive waveguide device designed for a tunable filter based on a ring-resonator. Polarization diversity circuits prevent polarization dependant issues in the silicon ring-resonator. For the device packaging, the YAG laser welding technique has been used for pigtailing both of the input and output fibers. Post welding misalignment was compensated by mechanical fine tuning using the seesaw effect via power monitoring. Packaging loss less than 1.5dB with respect to chip measurement has been achieved using 10 µm-curvature radius lensed fibers. In addition, the packaging process and the module performance are presented.

© 2011 OSA

OCIS Codes
(060.2340) Fiber optics and optical communications : Fiber optics components
(130.0130) Integrated optics : Integrated optics
(220.0220) Optical design and fabrication : Optical design and fabrication
(230.0230) Optical devices : Optical devices
(230.3120) Optical devices : Integrated optics devices
(130.3990) Integrated optics : Micro-optical devices

ToC Category:
Integrated Optics

Original Manuscript: May 18, 2011
Revised Manuscript: July 14, 2011
Manuscript Accepted: July 29, 2011
Published: August 30, 2011

Jeong Hwan Song, Jing Zhang, Huijuan Zhang, Chao Li, and Guo Qiang Lo, "Si-photonics based passive device packaging and module performance," Opt. Express 19, 18020-18028 (2011)

Sort:  Author  |  Year  |  Journal  |  Reset  


  1. L. Zimmermann, T. Tekin, H. Schroeder, P. Dumon, and W. Bogaerts, “How to bring nanophotonics to application-silicon photonics packaging,” IEEE LEOS Newsletter, 4–14, Dec. (2008).
  2. T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3µm square Si wire waveguides to singlemode fibers,” Electron. Lett. 38(25), 1669–1679 (2002). [CrossRef]
  3. F. Taillaert, M. Van Laere, W. Ayre, D. Bogaerts, P. Van Thourhout, Bienstman, and R. Baets, “Grating Couplers for Coupling between Optical Fibers and Nanophotonic Waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006). [CrossRef]
  4. F. E. Doany, B. G. Lee, S. Assefa, W. M. J. Green, M. Yang, C. L. Schow, C. V. Jahnes, S. Zhang, J. Singer, V. I. Kopp, J. A. Kash, and Y. A. Vlasov, “Multichannel high-bandwidth coupling of ultra-dense silicon photonic waveguide array to standard-pitch fiber array,” J. Lightwave Technol. 29(4), 475–482 (2011). [CrossRef]
  5. G. Roelkens, P. Dumon, W. Bogaerts, D. V. Thourhout, and R. Baets, “Efficient silicon on insulator fiber coupler fabricated using 248-nm deep UV lithography,” IEEE Photon. Technol. Lett. 17(12), 2613–2615 (2006). [CrossRef]
  6. B. B. Bakir, A. V. Gyves, R. Orobtchouk, P. Lyan, C. Porzier, A. Roman, and J. M. Fedeli, “Low-loss (<1dB) and polarization-insensitive edge fiber couplers fabricated on 200-mm silicon-on-insulator wafers,” IEEE Photon. Technol. Lett. 22(11), 739–741 (2010). [CrossRef]
  7. L. Zimmermann, G. B. Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics- A review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011). [CrossRef]
  8. T. Tekin, “Review of packaging of optoelectronic photonics, and MEMS components,” IEEE J. Sel. Top. Quantum Electron. 17(3), 704–719 (2011). [CrossRef]
  9. C. Kopp, S. Bernabe, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, and T. Tekin, “Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17(3), 498–509 (2011). [CrossRef]
  10. Y. Lin, W. Liu, and F. G. Shi, “Adhesive joint design for minimizing fiber alignment shift during UV curing,” IEEE Trans. Adv. Packag. 29(3), 520–524 (2006). [CrossRef]
  11. Y. Lin, C. Eichele, and F. G. Shi, “Effect of welding sequence on welding-induced-alignment-distortion in packaging of butterfly laser diode modules: simulation and experiment,” J. Lightwave Technol. 23(2), 615–623 (2005). [CrossRef]
  12. J. H. Song, H. N. J. Fernando, B. Roycroft, B. Corbett, and F. H. Peters, “Practical design of lensed fibers for semiconductor laser packaging using laser welding technique,” J. Lightwave Technol. 27(11), 1533–1539 (2009). [CrossRef]
  13. J. H. Song, P. O’Brien, and F. H. Peters, “Optimal laser welding assembly sequences for butterfly laser module packages,” Opt. Express 17(19), 16406–16414 (2009). [CrossRef] [PubMed]
  14. J. H. Song, B. Roycroft, B. Corbett, and F. H. Peters, “Experimental investigation of laser welding assembling sequences for butterfly laser module packages,” Opt. Eng. 49(1), 014301 (2010). [CrossRef]
  15. J. H. Song, M. Rensing, C. L. L. M. Daunt, P. O'Brien, and F. H. Peters, “Directly modulated laser diode module exceeding 10 Gb/s transmission,” IEEE Trans. Comp. Packg. Manuf. Technol. 1(6), 975–980 (2011). [CrossRef]
  16. J. Zhang, H. Zhang, S. Chen, M. Yu, G. Q. Lo, and D. L. Kwong, “A polarization diversity circuit for silicon photonics”, in Optical Fiber Communication Conference, OSA Technical Digest (CD), paper JThA019 (2011).
  17. J. Zhang, H. Zhang, S. Chen, M. Yu, G. Q. Lo, and D. L. Kwong, “A tunable polarization diversity silicon photonics filter,” Opt. Express 19(14), 13063–13072 (2011). [CrossRef] [PubMed]

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited