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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 19, Iss. 24 — Nov. 21, 2011
  • pp: 24115–24121

Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode

Bulong Wu, Xiaobing Luo, Huai Zheng, and Sheng Liu  »View Author Affiliations


Optics Express, Vol. 19, Issue 24, pp. 24115-24121 (2011)
http://dx.doi.org/10.1364/OE.19.024115


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Abstract

Gold wire bonding is an important packaging process of lighting emitting diode (LED). In this work, we studied the effect of gold wire bonding on the angular uniformity of correlated color temperature (CCT) in white LEDs whose phosphor layers were coated by freely dispersed coating process. Experimental study indicated that different gold wire bonding impacts the geometry of phosphor layer, and it results in different fluctuation trends of angular CCT at different spatial planes in one LED sample. It also results in various fluctuating amplitudes of angular CCT distributions at the same spatial plane for samples with different wire bonding angles. The gold wire bonding process has important impact on angular uniformity of CCT in LED package.

© 2011 OSA

OCIS Codes
(230.0230) Optical devices : Optical devices
(230.3670) Optical devices : Light-emitting diodes

ToC Category:
Optical Devices

History
Original Manuscript: September 16, 2011
Revised Manuscript: October 23, 2011
Manuscript Accepted: October 24, 2011
Published: November 10, 2011

Citation
Bulong Wu, Xiaobing Luo, Huai Zheng, and Sheng Liu, "Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode," Opt. Express 19, 24115-24121 (2011)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-19-24-24115


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References

  1. X. Luo, B. Wu, and S. Liu, “Effects of moist environments on LED module reliability,” IEEE Trans. Device Mater. Reliab.10(2), 182–186 (2010). [CrossRef]
  2. B. P. Loh, P. S. Andrews, and N. W. Medendorp, “Light emitting device packages, light emitting diode packages and related methods,” U.S. Patent 20,080,054,286 (Aug. 27, 2008).
  3. G. H. Negley and M. Leung, “Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension,” U.S. Patent 7,217,583 (May 15, 2007).
  4. G. O. Muller, R. G. Muller, M. R. Krames, P. J. Schmidt, H. H. Bechtel, J. Meyer, J. Graaf, and T. A. Kop, “Luminescent ceramics for a light emitting device,” U.S. Patent 7,361,938 (Apr. 22, 2008).
  5. B. Braune, K. Petersen, J. Strauss, P. Kromotis, and M. Kaempf, “A new wafer level coating technique to reduce the color distribution of LEDs,” Proc. SPIE6486, 64860X (2007). [CrossRef]
  6. J. P. You, N. T. Tran, and F. G. Shi, “Light extraction enhanced white light-emitting diodes with multi-layered phosphor configuration,” Opt. Express18(5), 5055–5060 (2010). [CrossRef] [PubMed]
  7. N. T. Tran and F. G. Shi, “Studies of phosphor concentration and thickness for phosphor-based white light-emitting-diodes,” J. Lightwave Technol.26(21), 3556–3559 (2008). [CrossRef]
  8. Z. Y. Liu, S. Liu, K. Wang, and X. B. Luo, “Optical analysis of phosphor’s location for high-power light emitting diodes,” IEEE Trans. Device Mater. Reliab.9(1), 65–73 (2009). [CrossRef]
  9. C. Sommer, F.-P. Wenzl, P. Hartmann, P. Pachler, M. Schweighart, S. Tasch, and G. Leising, “Tailoring of the color conversion elements in phosphor-converted high-power LEDs by optical simulations,” IEEE Photon. Technol. Lett.20(9), 739–741 (2008). [CrossRef]
  10. C. Sommer, F. P. Wenzl, F. Reil, J. R. Krenn, P. Hartmann, P. Pachler, and S. Tasch, “On the effect of light scattering in phosphor converted white light-emitting diodes,” in Solid-State and Organic Lighting, OSA Technical Digest (CD) (Optical Society of America, 2010), paper SOTuB5
  11. Y. Shuai, Y. Z. He, N. T. Tran, and F. G. Shi, “Angular CCT uniformity of phosphor converted white LEDs: effects of phosphor materials and packaging structures,” IEEE Photon. Technol. Lett.23(3), 137–139 (2011). [CrossRef]
  12. R. Yu, S. Jin, S. Cen, and P. Liang, “Effect of the phosphor geometry on the luminous flux of phosphor-converted light-emitting diodes,” IEEE Photon. Technol. Lett.22(23), 1765–1767 (2010). [CrossRef]
  13. K. Wang, D. Wu, F. Chen, Z. Y. Liu, X. B. Luo, and S. Liu, “Angular color uniformity enhancement of white light-emitting diodes integrated with freeform lenses,” Opt. Lett.35(11), 1860–1862 (2010). [CrossRef] [PubMed]
  14. H. Zheng, J. L. Ma, X. B. Luo, and S. Liu, “Precise model of phosphor geometry by conventional dispensing in LEDs packaging,” presented at the 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 8–11 Aug. 2011.

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