OSA's Digital Library

Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 19, Iss. 26 — Dec. 12, 2011
  • pp: B946–B951

Monolithic silicon chip with 10 modulator channels at 25 Gbps and 100-GHz spacing

Long Chen, Christopher R. Doerr, Po Dong, and Young-kai Chen  »View Author Affiliations

Optics Express, Vol. 19, Issue 26, pp. B946-B951 (2011)

View Full Text Article

Enhanced HTML    Acrobat PDF (2076 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



We demonstrate a chip containing ten low-chirp silicon modulators, each operating at 25 Gbps, multiplexed by a SiN arrayed-waveguide grating with 100-GHz spacing, showing the potential for 250 Gbps aggregated capacity on a 5×8 mm2 footprint.

© 2011 OSA

OCIS Codes
(060.4230) Fiber optics and optical communications : Multiplexing
(250.5300) Optoelectronics : Photonic integrated circuits
(250.7360) Optoelectronics : Waveguide modulators

ToC Category:
Waveguide and Opto-Electronic Devices

Original Manuscript: November 2, 2011
Revised Manuscript: November 30, 2011
Manuscript Accepted: December 1, 2011
Published: December 9, 2011

Virtual Issues
European Conference on Optical Communication 2011 (2011) Optics Express

Long Chen, Christopher R. Doerr, Po Dong, and Young-kai Chen, "Monolithic silicon chip with 10 modulator channels at 25 Gbps and 100-GHz spacing," Opt. Express 19, B946-B951 (2011)

Sort:  Author  |  Year  |  Journal  |  Reset  


  1. R. W. Tkach, “Scaling optical communications for the next decade and beyond,” Bell Labs Tech. J. 14, 3–9 (2010). [CrossRef]
  2. A. Narasimha, S. Abdalla, C. Bradbury, A. Clark, J. Clymore, J. Coyne, A. Dahl, S. Gloeckner, A. Gruenberg, D. Guckenberger, S. Gutierrez, M. Harrison, D. Kucharski, K. Leap, R. LeBlanc, Y. Liang, M. Mack, D. Martinez, G. Masini, A. Mekis, R. Menigoz, C. Ogden, M. Peterson, T. Pinguet, J. Redman, J. Rodriguez, S. Sahni, M. Sharp, T. J. Sleboda, D. Song, Y. Wang, B. Welch, J. Witzens, W. Xu, K. Yokoyama, and P. De Dobbelaere, “An ultra low power cmos photonics technology platform for h/s optoelectronic transceivers at less than $1 per Gbps,” in Optical Fiber Communication Conference, OSA Technical Digest (CD) (Optical Society of America, 2010), paper OMV4.
  3. L. Chen, C. Doerr, P. Dong, and Y. K. Chen, “Monolithic Silicon Chip with 10 Modulator Channels at 25 Gbps and 100-GHz Spacing,” European Conference on Optical Communication (ECOC) postdeadline Th.13.A.1 (2011).
  4. L. Chen, C. Doerr, Y. K. Chen, and T. Y. Liow, “Low-loss and broadband cantilever couplers between standard cleaved fibers and high-index-contrast Si3N4 or Si waveguides,” IEEE Photon. Tech. Lett. 22, 1744–1746 (2010). [CrossRef]
  5. A. Liu, L. Liao, D. Rubin, H. Nguyen, B. Ciftcioglu, Y. Chetrit, N. Izhaky, and M. Paniccia, “High-speed optical modulation based on carrier depletion in a silicon waveguide,” Opt. Express 15, 660–668 (2007). [CrossRef] [PubMed]
  6. D. J. Thomson, F. Y. Gardes, Y. Hu, G. Mashanovich, M. Fournier, P. Grosse, J-M. Fedeli, and G. T. Reed, “High contrast 40Gbit/s optical modulation in silicon,” Opt. Express 19, 11507–11516 (2011). [CrossRef] [PubMed]
  7. M. R. Watts, W. A. Zortman, D. C. Trotter, R. W. Young, and A. L. Lentine, “Low-voltage, compact, depletion-mode, silicon Mach-Zehnder modulator,” IEEE J. Sel. Top. Quantum Electron. 16, 159–164 (2010). [CrossRef]
  8. P. Dong, S. Liao, D. Feng, H. Liang, D. Zheng, R. Shafiiha, C.-C. Kung, W. Qian, G. Li, X. Zheng, A. V. Krishnamoorthy, and M. Asghari, “Low Vpp, ultralow-energy, compact, high-speed silicon electro-optic modulator,” Opt. Express 17, 22484–22490 (2009). [CrossRef]
  9. D. M. Gill, M. Rasras, K.-Y. Tu, Y.-K. Chen, A. E. White, S. S. Patel, D. Carothers, A. Pomerene, R. Kamocsai, C. Hill, and J. Beattie, “Internal bandwidth equalization in a CMOS compatible si ring modulator,” IEEE Photon. Technol. Lett. 21, 200–202 (2009). [CrossRef]
  10. G. T. Reed, G. Mashanovich, F. Y. Gardes, and D. J. Thomson, “Silicon optical modulators,” Nat. Photonics 4, 518–526 (2010). [CrossRef]
  11. S. Akiyama, H. Itoh, S. Sekiguchi, S. Hirose, T. Takeuchi, A. Kuramata, and T. Yamamoto, “InP-based Mach-Zehnder modulator with capacitively loaded traveling-wave electrodes,” J. Lightwave Technol. 26, 608–615 (2008). [CrossRef]
  12. T.-Y. Liow, K.-W. Ang, Q. Fang, J.-F. Song, Y.-Z. Xiong, M.-B. Yu, G.-Q. Lo, and D.-L. Kwong, “Silicon modulators and germanium photodetectors on SOI: monolithic integration, compatibility, and performance optimization,” IEEE J. Sel. Top. Quantum Electron. 16, 307–315 (2010). [CrossRef]
  13. C. R. Doerr, L. L. Buhl, Y. Baeyens, R. Aroca, S. Chandrasekhar, X. Liu, L. Chen, and Y.-K. Chen, “Packaged monolithic silicon 112-Gb/s coherent receiver,” IEEE Photon. Tech. Lett. 23, 762–764 (2011). [CrossRef]
  14. F. Koyama and K. Iga, “Frequency chirping in external modulators,” J. Lightwave Technol. 6, 87–93 (1988). [CrossRef]
  15. Y. Wei, Y. Zhao, J. Yang, M. Wang, and X. Jiang, “Chirp characteristics of silicon machzehnder modulator under small-signal modulation,” J. Lightwave Technol. 29, 1011–1017 (2011). [CrossRef]

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited