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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 20, Iss. 16 — Jul. 30, 2012
  • pp: 17667–17677

Optics InfoBase > Optics Express > Volume 20 > Issue 16 > Page 17667

Photonic wire bonding: a novel concept for chip-scale interconnects

N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos  »View Author Affiliations


Optics Express, Vol. 20, Issue 16, pp. 17667-17677 (2012)
http://dx.doi.org/10.1364/OE.20.017667


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Abstract

Photonic integration requires a versatile packaging technology that enables low-loss interconnects between photonic chips in three-dimensional configurations. In this paper we introduce the concept of photonic wire bonding, where polymer waveguides with three-dimensional freeform geometries are used to bridge the gap between nanophotonic circuits located on different chips. In a proof-of-principle experiment, we demonstrate the fabrication of single-mode photonic wire bonds (PWB) by direct-write two-photon lithography. First-generation prototypes allow for efficient broadband coupling with average insertion losses of only 1.6 dB in the C-band and can carry wavelength-division multiplexing signals with multi-Tbit/s data rates. Photonic wire bonding is well suited for automated mass production, and we expect the technology to enable optical multi-chip systems with enhanced performance and flexibility.

© 2012 OSA

OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(220.4241) Optical design and fabrication : Nanostructure fabrication
(130.6622) Integrated optics : Subsystem integration and techniques

ToC Category:
Integrated Optics

History
Original Manuscript: May 8, 2012
Revised Manuscript: July 13, 2012
Manuscript Accepted: July 17, 2012
Published: July 19, 2012

Citation
N. Lindenmann, G. Balthasar, D. Hillerkuss, R. Schmogrow, M. Jordan, J. Leuthold, W. Freude, and C. Koos, "Photonic wire bonding: a novel concept for chip-scale interconnects," Opt. Express 20, 17667-17677 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-16-17667


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