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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 20, Iss. 26 — Dec. 10, 2012
  • pp: B386–B392

A novel 3D stacking method for Opto-electronic dies on CMOS ICs

Pinxiang Duan, Oded. Raz, Barry. E. Smalbrugge, Jeroen Duis, and Harm. J. S Dorren  »View Author Affiliations


Optics Express, Vol. 20, Issue 26, pp. B386-B392 (2012)
http://dx.doi.org/10.1364/OE.20.00B386


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Abstract

A high speed, high density and potentially low cost solution for realizing a compact transceiver module is presented in this paper. It is based on directly bonding an Opto-electronic die on top of CMOS IC chip and creating a photoresist ramp to bridge the big step (around 220μm) from Opto-electronic pads to CMOS IC pads. The required electrical connection between them is realized lithographically with a process than can be scaled to full wafer production. A 12-channel transmitter based on the technique was fabricated and test shows good performance up to 12.5 Gb/s/ch.

© 2012 OSA

OCIS Codes
(130.0250) Integrated optics : Optoelectronics
(130.3120) Integrated optics : Integrated optics devices
(200.0200) Optics in computing : Optics in computing
(200.4650) Optics in computing : Optical interconnects
(220.3740) Optical design and fabrication : Lithography
(140.7260) Lasers and laser optics : Vertical cavity surface emitting lasers

ToC Category:
Waveguide and Optoelectronic Devices

History
Original Manuscript: October 3, 2012
Revised Manuscript: November 11, 2012
Manuscript Accepted: November 11, 2012
Published: November 29, 2012

Virtual Issues
European Conference on Optical Communication 2012 (2012) Optics Express

Citation
Pinxiang Duan, Oded. Raz, Barry. E. Smalbrugge, Jeroen Duis, and Harm. J. S Dorren, "A novel 3D stacking method for Opto-electronic dies on CMOS ICs," Opt. Express 20, B386-B392 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-26-B386


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References

  1. D. A. B. Miller, “Rationale and challenges for optical interconnects to electronic chips,” Proc. IEEE88(6), 728–749 (2000). [CrossRef]
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  7. P. Duan, O. Raz, B. E. Smalbrugge, J. Duis, and H. J. S. Dorren, “Chip-to-chip interconnects based on 3D stacking of opto-electrical dies on Si, ” in the Proc. SPIE. 8267, Optoelectronic Interconnects XII, 82670U (San Francisco, 2012).

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