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Optics Express

Optics Express

  • Editor: Michael Duncan
  • Vol. 13, Iss. 7 — Apr. 4, 2005
  • pp: 2731–2741

Deterministic control of thin film thickness in physical vapor deposition systems using a multi-aperture mask

John Arkwright, Ian Underhill, Nathan Pereira, and Mark Gross  »View Author Affiliations

Optics Express, Vol. 13, Issue 7, pp. 2731-2741 (2005)

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A technique for controlling the thickness profile of a thin film in physical vapor deposition systems is reported. The technique uses a novel mask design with apertures of varying dimension to selectively deposit the required film thickness at predetermined locations across the aperture of the substrate. The technique has been used to correct the thickness uniformity of a 55 mm diameter, 280 µm thick, lithium niobate wafer to less than 0.5 nm rms, and also to improve the uniformity of deposited films in an Ion Beam Sputtering system to better than 0.5% over a 50 mm aperture.

© 2005 Optical Society of America

OCIS Codes
(220.4610) Optical design and fabrication : Optical fabrication
(310.1620) Thin films : Interference coatings
(310.1860) Thin films : Deposition and fabrication

ToC Category:
Research Papers

Original Manuscript: February 23, 2005
Revised Manuscript: March 23, 2005
Published: April 4, 2005

John Arkwright, Ian Underhill, Nathan Pereira, and Mark Gross, "Deterministic control of thin film thickness in physical vapor deposition systems using a multi-aperture mask," Opt. Express 13, 2731-2741 (2005)

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