45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects

doi:10.1364/OE.17.010514

45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects

Fengtao Wang, Fuhan Liu, and Ali Adibi »View Author Affiliations

Optics Express, Vol. 17, Issue 13, pp. 10514-10521 (2009)
http://dx.doi.org/10.1364/OE.17.010514

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Abstract
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Abstract

We introduce here a simple method of integrating 45° total internal reflection micro-mirrors with polymer optical waveguides by an improved tilted beam photolithography on printed circuit boards to provide surface normal light coupling between waveguides and optoelectronic devices for optical interconnects. De-ionized water is used to couple ultraviolet beam through the waveguide core polymer layer at 45° angle during the photo exposure process. This technique is compatible with PCB manufacturing facility and suitable to large panel board-level manufacturing. The mirror slope is controlled accurately (within ± 1°) with high repeatability. The insertion loss of an uncoated micro-mirror is measured to be 1.6 dB.

OCIS Codes
(120.4610) Instrumentation, measurement, and metrology : Optical fabrication
(130.3120) Integrated optics : Integrated optics devices
(130.5460) Integrated optics : Polymer waveguides

ToC Category:
Integrated Optics

History
Original Manuscript: April 20, 2009
Revised Manuscript: May 27, 2009
Manuscript Accepted: May 29, 2009
Published: June 8, 2009

Citation
Fengtao Wang, Fuhan Liu, and Ali Adibi, "45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects," Opt. Express 17, 10514-10521 (2009)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-17-13-10514

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References

A. V. Krishnamoorthy and D. A. B. Miller, “Scaling optoelectronic-VLSI circuits into the 21st century: A technology roadmap,” IEEE J. Sel. Top. Quantum Electron. 2(1), 55–76 (2006).
J. W. Goodman, F. J. Leonberger, S.-Y. Kung, and R. A. Athale, “Optical interconnects for VLSI systems,” Proc. IEEE 72(7), 850–866 (1984). [CrossRef]
M. Li and S. J. Sheard, “Waveguide couplers using parallelogramic-shaped blazed gratings,” Opt. Commun. 109(3–4), 239–245 (1994). [CrossRef]
J. T. Kim, B. C. Kim, M. Jeong, and M. Lee, “Fabrication of a micro-optical coupling structure by laser ablation,” J. Mater. Process. Technol. 146(2), 163–166 (2004). [CrossRef]
L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006). [CrossRef]
N. Herdrickx, J. V. Erps, G. V. Steenberge, H. Thienpont, and P. V. Daele, “Laser ablated micromirrors for printed circuit board integrated optical interconnections,” IEEE Photon. Technol. Lett. 19(11), 822–824 (2007). [CrossRef]
S. Garner, S.-S. Lee, V. Chuyanov, A. Chen, A. Yacoubian, W. Steier, and L. Dalton, ““Three-dimensional integrated optics using polymers,” IEEE J. Quantum Electron. 35(8), 1146–1155 (1999). [CrossRef]
S. Lehmacher and A. Neyer, “Integration of polymer optical waveguides into printed circuit boards,” Electron. Lett. 36(12), 1052–1053 (2000). [CrossRef]
L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. T. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005). [CrossRef]
M. Kagami, A. Kawasaki, and H. Ito, “A polymer optical waveguide with out-of-plane branching mirrors for surface-normal optical interconnections,” J. Lightwave Technol. 19(12), 1949–1955 (2001). [CrossRef]
A. L. Glebov, J. Roman, M. G. Lee, and K. Yokouchi, “Optical interconnect modules with fully integrated reflector mirrors,” IEEE Photon. Technol. Lett. 17(7), 1540–1542 (2005). [CrossRef]
S. Han, I. Cho, S. Hwang, W. Lee, and S. Ahn, “A high-density two-dimensional parallel optical interconnection module,” IEEE Photon. Technol. Lett. 17(11), 2448–2450 (2005). [CrossRef]
N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008). [CrossRef]
M. Moyniham, B. Sicard, and T. Ho, “etc., “Progress toward board-level Optical Interconnect technology,” Proc. SPIE 5731, 50–62 (2005). [CrossRef]
T. Yoshimura, M. Miyazaki, Y. Miyamoto, N. Shimoda, A. Hori, and K. Asama, “Three-dimensional optical circuits consisting of waveguide films and optical z-connections,” J. Lightwave Technol. 24(11), 4345–4352 (2006). [CrossRef]
K. Y. Hung, H. T. Hu, and F. G. Tseng, “A novel fabrication technology for smooth 3D inclined polymer microstructures with adjustable angles,” Proceedings of the International Conference on Solid Sate Sensors, Actuators and Microsystems, USA, 821–824 (2003).
F. Wang, F. Liu, A. Adibi, and R. Tummala, “A Simple Method to Fabricate 45° Polymer Micro-Mirrors for Three-Dimensional Board-Level Optical Interconnects”, The 90th OSA Annual meeting, Laser Science XXI, Optical Society of America, 8–12 (2006).
F. Wang, F. Liu, G. K. Chang, and A. Adibi, “Precision Measurements for Propagation Properties of High Definition Polymer Waveguides by Imaging of Scattered Light,” Opt. Eng. 47(2), 024602 (2008). [CrossRef]

Adibi, A.
Ahn, S.
Asama, K.
Athale, R. A.
Baks, C. W.
Bi, H.
Bosman, E.
Bour, D. P.
Budd, R. A.
Chang, G. K.
Chen, A.
Chen, R. T.
Chiniwalla, P.
Cho, I.
Choi, J.
Chuyanov, V.
Daele, P. V.
Dalton, L.
Dangel, R.
Debaes, C.
Doany, F. E.
Dolfi, D. W.
Erps, J. V.
Garner, S.
Glebov, A. L.
Goodman, J. W.
Guckenberger, D.
Han, S.
Hegde, S.
Hendrickx, N.
Herdrickx, N.
Ho, T.
Hori, A.
Horst, F.
Hwang, S.
Ito, H.
Jeong, M.
Jiang, W.
John, R. A.
Kagami, M.
Kash, J. A.
Kawasaki, A.
Kim, B. C.
Kim, J. T.
Krishnamoorthy, A. V.
Kucharski, D.
Kuchta, D. M.
Kung, S.-Y.
Kwark, Y. H.
Lee, M.
Lee, M. G.
Lee, S.-S.
Lee, W.
Lehmacher, S.
Leonberger, F. J.
Li, M.
Libsch, F. R.
Lin, C.
Liu, F.
Miller, D. A. B.
Miyamoto, Y.
Miyazaki, M.
Moyniham, M.
Neyer, A.
Nyikal, H.
Nystrom, M.
Offrein, B. J.
Patel, C. S.
Pepeljugoski, P. K.
Roman, J.
Rosner, J.
Schares, L.
Schaub, J. D.
Schow, C. L.
Schuster, C.
Shan, L.
Sheard, S. J.
Shimoda, N.
Sicard, B.
Steenberge, G. V.
Steier, W.
Tan, M. R. T.
Tandon, A.
Thienpont, H.
Trewhella, J. M.
Trott, G. R.
Tsang, C. K.
Van Daele, P.
Van Erps, J.
Wang, F.
Wang, L.
Wang, X.
Yacoubian, A.
Yokouchi, K.
Yoshimura, T.

Appl. Phys. Lett.

L. Wang, X. Wang, W. Jiang, J. Choi, H. Bi, and R. T. Chen, “45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects,” Appl. Phys. Lett. 87(14), 141110 (2005). [CrossRef]

Electron. Lett.

S. Lehmacher and A. Neyer, “Integration of polymer optical waveguides into printed circuit boards,” Electron. Lett. 36(12), 1052–1053 (2000). [CrossRef]

IEEE J. Quantum Electron.

S. Garner, S.-S. Lee, V. Chuyanov, A. Chen, A. Yacoubian, W. Steier, and L. Dalton, ““Three-dimensional integrated optics using polymers,” IEEE J. Quantum Electron. 35(8), 1146–1155 (1999). [CrossRef]

IEEE J. Sel. Top. Quantum Electron.

L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006). [CrossRef]
A. V. Krishnamoorthy and D. A. B. Miller, “Scaling optoelectronic-VLSI circuits into the 21st century: A technology roadmap,” IEEE J. Sel. Top. Quantum Electron. 2(1), 55–76 (2006).

IEEE Photon. Technol. Lett.

N. Herdrickx, J. V. Erps, G. V. Steenberge, H. Thienpont, and P. V. Daele, “Laser ablated micromirrors for printed circuit board integrated optical interconnections,” IEEE Photon. Technol. Lett. 19(11), 822–824 (2007). [CrossRef]
A. L. Glebov, J. Roman, M. G. Lee, and K. Yokouchi, “Optical interconnect modules with fully integrated reflector mirrors,” IEEE Photon. Technol. Lett. 17(7), 1540–1542 (2005). [CrossRef]
S. Han, I. Cho, S. Hwang, W. Lee, and S. Ahn, “A high-density two-dimensional parallel optical interconnection module,” IEEE Photon. Technol. Lett. 17(11), 2448–2450 (2005). [CrossRef]
N. Hendrickx, J. Van Erps, E. Bosman, C. Debaes, H. Thienpont, and P. Van Daele, “Embedded micromirror inserts for optical printed circuit boards,” IEEE Photon. Technol. Lett. 20(20), 1727–1729 (2008). [CrossRef]

J. Lightwave Technol.

J. Mater. Process. Technol.

J. T. Kim, B. C. Kim, M. Jeong, and M. Lee, “Fabrication of a micro-optical coupling structure by laser ablation,” J. Mater. Process. Technol. 146(2), 163–166 (2004). [CrossRef]

Opt. Commun.

M. Li and S. J. Sheard, “Waveguide couplers using parallelogramic-shaped blazed gratings,” Opt. Commun. 109(3–4), 239–245 (1994). [CrossRef]

Opt. Eng.

F. Wang, F. Liu, G. K. Chang, and A. Adibi, “Precision Measurements for Propagation Properties of High Definition Polymer Waveguides by Imaging of Scattered Light,” Opt. Eng. 47(2), 024602 (2008). [CrossRef]

Proc. IEEE

J. W. Goodman, F. J. Leonberger, S.-Y. Kung, and R. A. Athale, “Optical interconnects for VLSI systems,” Proc. IEEE 72(7), 850–866 (1984). [CrossRef]

Proc. SPIE

M. Moyniham, B. Sicard, and T. Ho, “etc., “Progress toward board-level Optical Interconnect technology,” Proc. SPIE 5731, 50–62 (2005). [CrossRef]

Other

K. Y. Hung, H. T. Hu, and F. G. Tseng, “A novel fabrication technology for smooth 3D inclined polymer microstructures with adjustable angles,” Proceedings of the International Conference on Solid Sate Sensors, Actuators and Microsystems, USA, 821–824 (2003).
F. Wang, F. Liu, A. Adibi, and R. Tummala, “A Simple Method to Fabricate 45° Polymer Micro-Mirrors for Three-Dimensional Board-Level Optical Interconnects”, The 90th OSA Annual meeting, Laser Science XXI, Optical Society of America, 8–12 (2006).

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