Compact and passive-alignment 4-channel × 2.5-Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors

doi:10.1364/OE.17.024250

Compact and passive-alignment 4-channel × 2.5-Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors

Hsu-Liang Hsiao, Hsiao-Chin Lan, Chia-Chi Chang, Chia-Yu Lee, Siou-Ping Chen, Chih-Hung Hsu, Shuo-Fu Chang, Yo-Shen Lin, Feng-Ming Kuo, Jin-Wei Shi, and Mount-Learn Wu »View Author Affiliations

Optics Express, Vol. 17, Issue 26, pp. 24250-24260 (2009)
http://dx.doi.org/10.1364/OE.17.024250

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Abstract

Compact and passive-alignment 4-channel × 2.5-Gbps optical interconnect modules are developed based on the silicon optical benches (SiOBs) of 5 × 5 mm². A silicon-based 45° micro-reflector and V-groove arrays are fabricated on the SiOB using anisotropic wet etching. Moreover, high-frequency transmission lines of 4 channel × 2.5 Gbps, and bonding pads with Au/Sn eutectic solder are also deposited on the SiOB. The vertical-cavity surface-emitting laser (VCSEL) array and photo-detector (PD) array are flip-chip assembled on the intended positions. The multi-mode fiber (MMF) ribbons are passively aligned and mounted onto the V-groove arrays. Without the assistance of additional optics, the coupling efficiencies of VCSEL-to-MMF in the transmitting part and MMF-to-PD in the receiving part can be as high as −5.65 and −1.98 dB, respectively, under an optical path of 180 μm. The 1-dB coupling tolerance of greater than ± 20 μm is achieved for both transmitting and receiving parts. Eye patterns of both parts are demonstrated using 15-bit PRBS at 2.5 Gbps.

OCIS Codes
(130.3120) Integrated optics : Integrated optics devices
(200.4650) Optics in computing : Optical interconnects
(230.4040) Optical devices : Mirrors
(130.3990) Integrated optics : Micro-optical devices

ToC Category:
Integrated Optics

History
Original Manuscript: October 7, 2009
Revised Manuscript: December 14, 2009
Manuscript Accepted: December 14, 2009
Published: December 18, 2009

Citation
Hsu-Liang Hsiao, Hsiao-Chin Lan, Chia-Chi Chang, Chia-Yu Lee, Siou-Ping Chen, Chih-Hung Hsu, Shuo-Fu Chang, Yo-Shen Lin, Feng-Ming Kuo, Jin-Wei Shi, and Mount-Learn Wu, "Compact and passive-alignment 4-channel × 2.5-Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors," Opt. Express 17, 24250-24260 (2009)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-17-26-24250

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References

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P. Lukowicz, J. Jahns, R. Barbieri, P. Benabes, T. Bierhoff, A. Gauthier, M. Jarczynski, G. A. Russell, J. Schrage, W. Sullau, J. F. Snowdon, M. Wirz, and G. Troster, “Optoelectronic interconnection technology in the HOLMS system,” IEEE J. Sel. Top. Quantum Electron. 9(2), 624–635 (2003). [CrossRef]
H. L. Althaus, W. Gramann, and K. Panzer, “Microsystems and wafer processes for volume production of highly reliable fiber optic components for telecom- and datacom-application,” IEEE Trans. on Compon. Packag. and Manufact. Technol. pt. B, 21(2), 147–156 (1998). [CrossRef]
H. Takahara, “Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems,” IEEE J. Sel. Top. Quantum Electron. 9(2), 443–451 (2003). [CrossRef]
D. Shimura, R. Sekikawa, K. Kotani, M. Uekawa, Y. Maeno, K. Aoyama, H. Sasaki, T. Takamori, K. Masuko, and S. Nakaya, “Bidirectional optical subassembly with prealigned silicon microlens and laser diode,” IEEE Photon. Technol. Lett., vol.18, no.16, pp. 1738–1740, Aug. (2006).
Y. Ishii, N. Tanaka, T. Sakamoto, and H. Takahara, “Fully SMT-compatible optical –I/O package with microlens array interface,” IEEE J. Lightwave Technol. 21(1), 275–280 (2003). [CrossRef]
B. S. Rho, S. Kang, H. S. Cho, H. H. Park, S. W. Ha, and B. H. Rhee, “PCB-compatible optical interconnection using 45°-ended connection rods and via-holed waveguides,” IEEE J. Lightwave Technol. 22(9), 2128–2134 (2004). [CrossRef]
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I. Zubel, “Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si(100) anisotropic etching in KOH and KOH+IPA solutions,” Sens. Actuators A Phys. 84(1), 116–125 (2000). [CrossRef]
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Adibi, A.
Ahearn, J. S.
Alameh, K. E.
Ali, M. E.
Aljada, M.
Althaus, H. L.
An, J. Y.
Baks, C. W.
Barbieri, R.
Benabes, P.
Bierhoff, T.
Bour, D. P.
Budd, R. A.
Chang, C. C.
Chateauneuf, M.
Chen, R. T.
Chiniwalla, P.
Cho, H. S.
Cho, S. R.
Choi, W. C.
Chung, I. S.
Dangel, R.
Dannberg, P.
Doany, F. E.
Dolfi, D. W.
Faucher, J.
Flower, G. M.
Gauthier, A.
Gramann, W.
Gruber, M.
Guckenberger, D.
Ha, S. W.
Hegde, S.
Heming, R.
Hiramatsu, S.
Horst, F.
Hsiao, H. L.
Hsu, C. H.
Hwang, S. H.
Ishii, Y.
Jahns, J.
Jarczynski, M.
John, R. A.
Kang, S.
Kash, J. A.
Kim, M. H.
Kirk, A. G.
Kley, E. B.
Kucharski, D.
Kuchta, D. M.
Kwark, Y. H.
Lan, H. C.
Laprise, E.
Lee, S. H.
Lee, Y. T.
Lemoff, B. E.
Levi, A. F. J.
Libsch, F. R.
Lin, C.-K.
Liu, F.
Lukowicz, P.
Madhavan, B.
Mikawa, T.
Nyikal, H.
Nystrom, M.
Offrein, B. J.
Panotopoulos, G.
Panzer, K.
Park, H. H.
Park, H.-H.
Patel, C. S.
Pepeljugoski, P. K.
Plant, D. V.
Razavi, K.
Rhee, B. H.
Rho, B. S.
Rosner, J.
Russell, G. A.
Sakamoto, T.
Schares, L.
Schaub, J. D.
Schow, C. L.
Schrage, J.
Schuster, C.
Shan, L.
Snowdon, J. F.
Sullau, W.
Takahara, H.
Tan, M. R. T.
Tanaka, N.
Tandon, A.
Trewhella, J. M.
Troster, G.
Trott, G. R.
Tsang, C. K.
Venditti, M. B.
Wang, C. M.
Wang, F.
Wang, X.
Wirz, M.
Wittig, L. C.
Wu, M. L.
Zubel, I.

IEEE J. Lightwave Technol.

B. E. Lemoff, M. E. Ali, G. Panotopoulos, G. M. Flower, B. Madhavan, A. F. J. Levi, and D. W. Dolfi, “MAUI: Enabling fiber-to-processor with parallel multiwavelength optical interconnects,” IEEE J. Lightwave Technol. 22(9), 2043–2054 (2004). [CrossRef]
D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Chateauneuf, A. G. Kirk, and J. S. Ahearn, “256-channel bidirectional optical interconnect using VCSELs and photodiodes on CMOS,” IEEE J. Lightwave Technol. 19(8), 1093–1103 (2001). [CrossRef]
R. Heming, L. C. Wittig, P. Dannberg, J. Jahns, E. B. Kley, and M. Gruber, “Efficient planar-integrated free-space optical interconnects fabricated by a combination of binary and analog lithography,” IEEE J. Lightwave Technol. 26(14), 2136–2141 (2008). [CrossRef]
Y. Ishii, N. Tanaka, T. Sakamoto, and H. Takahara, “Fully SMT-compatible optical –I/O package with microlens array interface,” IEEE J. Lightwave Technol. 21(1), 275–280 (2003). [CrossRef]
B. S. Rho, S. Kang, H. S. Cho, H. H. Park, S. W. Ha, and B. H. Rhee, “PCB-compatible optical interconnection using 45°-ended connection rods and via-holed waveguides,” IEEE J. Lightwave Technol. 22(9), 2128–2134 (2004). [CrossRef]

IEEE J. Sel. Top. Quantum Electron.

H. Takahara, “Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems,” IEEE J. Sel. Top. Quantum Electron. 9(2), 443–451 (2003). [CrossRef]
P. Lukowicz, J. Jahns, R. Barbieri, P. Benabes, T. Bierhoff, A. Gauthier, M. Jarczynski, G. A. Russell, J. Schrage, W. Sullau, J. F. Snowdon, M. Wirz, and G. Troster, “Optoelectronic interconnection technology in the HOLMS system,” IEEE J. Sel. Top. Quantum Electron. 9(2), 624–635 (2003). [CrossRef]
L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, “Terabus: Terabit/second-class card-level optical interconnect technologies,” IEEE J. Sel. Top. Quantum Electron. 12(5), 1032–1044 (2006). [CrossRef]
S. Hiramatsu and T. Mikawa, “Optical design of active interposer for high-speed chip level optical interconnects,” IEEE J. Sel. Top. Quantum Electron. 24(2), 927–934 (2006).

IEEE Photon. Technol. Lett.

S. H. Hwang, J. Y. An, M. H. Kim, W. C. Choi, S. R. Cho, S. H. Lee, H. S. Cho, and H.-H. Park, “VCSEL array module using (111) facet mirrors of a V-grooved silicon optical bench and angled fibers,” IEEE Photon. Technol. Lett. 17(2), 477–479 (2005). [CrossRef]

IEEE Trans. on Compon. Packag. and Manufact. Technol.

H. L. Althaus, W. Gramann, and K. Panzer, “Microsystems and wafer processes for volume production of highly reliable fiber optic components for telecom- and datacom-application,” IEEE Trans. on Compon. Packag. and Manufact. Technol. pt. B, 21(2), 147–156 (1998). [CrossRef]

Opt. Express

Proc. SPIE

X. Wang and R. T. Chen, “Fully embedded board level optical interconnects—From point-to-point interconnection to optical bus architecture,” Proc. SPIE 6899, 6899031–6899039 (2008).

Sens. Actuators A Phys.

I. Zubel, “Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si(100) anisotropic etching in KOH and KOH+IPA solutions,” Sens. Actuators A Phys. 84(1), 116–125 (2000). [CrossRef]

Other

D. Shimura, R. Sekikawa, K. Kotani, M. Uekawa, Y. Maeno, K. Aoyama, H. Sasaki, T. Takamori, K. Masuko, and S. Nakaya, “Bidirectional optical subassembly with prealigned silicon microlens and laser diode,” IEEE Photon. Technol. Lett., vol.18, no.16, pp. 1738–1740, Aug. (2006).

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