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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 17, Iss. 3 — Feb. 2, 2009
  • pp: 1215–1221

Intra-system optical interconnection module directly integrated on a polymeric optical waveguide

B. S. Rho, S. H. Hwang, J. W. Lim, G. W. Kim, C. H. Cho, and W.-J. Lee  »View Author Affiliations

Optics Express, Vol. 17, Issue 3, pp. 1215-1221 (2009)

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A new intra-system optical interconnection module directly integrated on a polymeric optical waveguide is suggested. A polymeric optical waveguide plays a role in the propagation path of optical signals from the transmitter to the receiver and in a platform integrated with various optical/electrical devices such as a vertical cavity surface emitting laser, photodiode, very large scale integrated circuit chips, and electrical connectors. Because the polymeric optical waveguide is simultaneously used as an integrated platform, the fabrication process of the optical interconnection module is very simple, and the proposed process is compatible with the conventional printed circuit board process. The suggested optical interconnection was also successfully demonstrated with a 5-Gb/s data transmission through the module directly integrated on a polymeric optical waveguide.

© 2009 Optical Society of America

OCIS Codes
(200.4650) Optics in computing : Optical interconnects
(220.4610) Optical design and fabrication : Optical fabrication
(250.3140) Optoelectronics : Integrated optoelectronic circuits

ToC Category:

Original Manuscript: November 17, 2008
Revised Manuscript: January 3, 2009
Manuscript Accepted: January 8, 2009
Published: January 21, 2009

B. S. Rho, S. H. Hwang, J. W. Lim, G. W. Kim, C. H. Cho, and W.-J. Lee, "Intra-system optical interconnection module directly integrated on a polymeric optical waveguide," Opt. Express 17, 1215-1221 (2009)

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  1. A. F. J. Levi, "Optical interconnections in systems," Proc. IEEE 88, (2000), pp. 750-757 [CrossRef]
  2. S. H. Hwang, M. H. Cho, S. -K. Kang, H. -H. Park, H. S. Cho, S. -H. Kim, K. -U. Shin, and S. -W. Ha, "Passively assembled optical interconnection system based on an optical printed-circuit board," IEEE Photon. Technol. Lett. 18, 652-654 (2006) [CrossRef]
  3. F. Mederer, R. Jager, H. J. Unold, R. Michalzik, K. J. Ebeling, S. Lehmacher, A. Neyer, and E. Griese, "3-Gb/s data transmission with GaAs VCSELs over PCB integrated polymer waveguide," IEEE Photon. Technol. Lett. 13, 1032-1034 (2001) [CrossRef]
  4. Y. Ishii, N. Tanaka, T. Sakamoto, and H. Takahara, "Fully SMT-compatible optical I/O package with microlens array interface," J. Lightwave Technol. 21, 275-280 (2003) [CrossRef]
  5. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner, J. Bristow, and Y. S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects," Proc. IEEE 88, 780-793 (2000) [CrossRef]
  6. L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan, and D. W. Dolfi, "Terabus: Terabit/Second-Class card-level optical interconnect technologies" IEEE J. Sel. Topics Quantum Electron. 12, 1032-1044 (2006) [CrossRef]
  7. B. S. Rho, W. -J. Lee, J. W. Lim, K. Y. Jung, K. S. Cha, and S. H. Hwang, "Fabrication and reliability of rigid-flexible optical electrical printed circuit board for mobile devices," IEEE Photon. Technol. Lett. 20, 964-966 (2008) [CrossRef]

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