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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 18, Iss. 22 — Oct. 25, 2010
  • pp: 23488–23494

Very large spot size effect in nanosecond laser drilling efficiency of silicon

F. Brandi, N. Burdet, R. Carzino, and A. Diaspro  »View Author Affiliations

Optics Express, Vol. 18, Issue 22, pp. 23488-23494 (2010)

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The effect of the spot diameter in nanosecond excimer laser percussion drilling of through via in silicon wafer is presented. Experimental results show a ten fold increase of the ablation efficiency when decreasing the spot diameter from 220 μm to 9 μm at constant fluence in the range 7.5 J/cm2 to 13.2 J/cm2. Such effect is absent when using 60 ps deep-UV laser pulses. A model is developed that explain the findings in terms of plume shielding effect on the laser pulse. The model is successfully applied also on previously published data on deep-UV laser drilling of Polyimide and Alumina.

© 2010 Optical Society of America

OCIS Codes
(160.6000) Materials : Semiconductor materials
(350.3390) Other areas of optics : Laser materials processing

ToC Category:
Laser Microfabrication

Original Manuscript: September 17, 2010
Revised Manuscript: October 12, 2010
Manuscript Accepted: October 17, 2010
Published: October 22, 2010

Fernando Brandi, Nicolas Burdet, Riccardo Carzino, and Alberto Diaspro, "Very large spot size effect in nanosecond laser drilling efficiency of silicon," Opt. Express 18, 23488-23494 (2010)

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