Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)

doi:10.1364/OE.19.013343

Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)

Woo June Choi, Sung Pyo Jung, Jun Geun Shin, Danning Yang, and Byeong Ha Lee »View Author Affiliations

Optics Express, Vol. 19, Issue 14, pp. 13343-13350 (2011)
http://dx.doi.org/10.1364/OE.19.013343

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Abstract

Chemical mechanical polishing (CMP) is a key process for global planarization of silicon wafers for semiconductors and AlTiC wafers for magnetic heads. Removal rate of wafer material is directly dependent on the surface roughness of a CMP pad, thus the structure of the pad surface has been evaluated with variable techniques. However, under in situ CMP process, the measurements have been severely limited due to the existence of polishing fluids including the slurry on the pad surface. In here, we newly introduce ultra-high resolution full-field optical coherence tomography (FF-OCT) to investigate the surface of wet pads. With FF-OCT, the wet pad surface could be quantitatively characterized in terms of the polishing pad lifetime, and also be three-dimensionally visualized. We found that reasonable polishing span could be evaluated from the surface roughness measurement and the groove depth measurement made by FF-OCT.

OCIS Codes
(110.4500) Imaging systems : Optical coherence tomography
(120.6660) Instrumentation, measurement, and metrology : Surface measurements, roughness
(240.5450) Optics at surfaces : Polishing

ToC Category:
Instrumentation, Measurement, and Metrology

History
Original Manuscript: April 21, 2011
Revised Manuscript: June 11, 2011
Manuscript Accepted: June 12, 2011
Published: June 27, 2011

Virtual Issues
Vol. 6, Iss. 8 Virtual Journal for Biomedical Optics

Citation
Woo June Choi, Sung Pyo Jung, Jun Geun Shin, Danning Yang, and Byeong Ha Lee, "Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)," Opt. Express 19, 13343-13350 (2011)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-19-14-13343

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References

P. B. Zantye, A. Kumar, and A. K. Sikder, “Chemical mechanical planarization for microelectronics applications,” Mater. Sci. Eng. Rep. 45(3-6), 89–220 (2004). [CrossRef]
D. Stein, D. Hetherington, M. Dugger, and T. Stout, “Optical interferometry for surface measurements of CMP pads,” J. Electron. Mater. 25(10), 1623–1627 (1996). [CrossRef]
R. J. Gutmann, J. M. Steigerwald, L. You, D. T. Price, J. Neirynck, D. J. Duquette, and S. P. Murarka, “Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics,” Thin Solid Films 270(1-2), 596–600 (1995). [CrossRef]
Z. Stavreva, D. Zeidler, M. Plötner, G. Grasshoff, and K. Drescher, “Chemical-mechanical polishing of copper for interconnect formation,” Microelectron. Eng. 33(1-4), 249–257 (1997). [CrossRef]
H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49(1), 35–44 (2002). [CrossRef]
K. H. Park, H. J. Kim, O. M. Chang, and H. D. Jeong, “Effects of pad properties on material removal in chemical mechanical polishing,” J. Mater. Process. Technol. 187-188, 73–76 (2007). [CrossRef]
T. Sun, Y. Zhuang, L. Borucki, and A. Philipossian, “Optical and mechanical characterization of chemical mechanical planarization pad surfaces,” Jpn. J. Appl. Phys. 49(4), 046501 (2010). [CrossRef]
J. McGrath and C. Davis, “Polishing pad surface characterisation in chemical mechanical planarisation,” J. Mater. Process. Technol. 153–154, 666–673 (2004). [CrossRef]
H. Lee, D.-I. Kim, H. Jeong, and K. H. Kim, “Chemical mechanical polishing of a Ti-Si-N nanocomposite and AFM study on its nanostructure,” J. Korean Phys. Soc. 57(4), 845–849 (2010). [CrossRef]
Y. Zhuang, X. Liao, L. J. Borucki, S. Theng, X. Wei, T. Ashizawa, and A. Philipossian, “Effect of pad micro-texture on frictional force, removal rate, and wafer topography during copper CMP process,” Elec. Soc. Trans. 27(1), 599–604 (2010).
S. Nagai, T. Fujishima, and K. Sameshima, “Nondestructive monitoring of CMP pad surface,” IEEE International Symposium on Semiconductor Manufacturing, 343–346 (2003).
D. G. Totzke, A. Belyaev, W. Moreno, S. Ostapenko, I. Tarasov, W. Easter, A. Maury, and A. Crevasse, “Non-destructive characterization of CMP pads using scanning ultrasonic transmission,” AIP Conf. Proc. 550, 259–262 (2001). [CrossRef]
A. Dubois, K. Grieve, G. Moneron, R. Lecaque, L. Vabre, and C. Boccara, “Ultrahigh-resolution full-field optical coherence tomography,” Appl. Opt. 43(14), 2874–2883 (2004). [CrossRef] [PubMed]
W. Y. Oh, B. E. Bouma, N. Iftimia, S. H. Yun, R. Yelin, and G. J. Tearney, “Ultrahigh-resolution full-field optical coherence microscopy using InGaAs camera,” Opt. Express 14(2), 726–735 (2006). [CrossRef] [PubMed]
M. Akiba, N. Maeda, K. Yumikake, T. Soma, K. Nishida, Y. Tano, and K. P. Chan, “Ultrahigh-resolution imaging of human donor cornea using full-field optical coherence tomography,” J. Biomed. Opt. 12(4), 041202 (2007). [CrossRef] [PubMed]
G. Latour, J.-P. Echard, B. Soulier, I. Emond, S. Vaiedelich, and M. Elias, “Structural and optical properties of wood and wood finishes studied using optical coherence tomography: application to an 18th century Italian violin,” Appl. Opt. 48(33), 6485–6491 (2009). [CrossRef] [PubMed]
L. Vabre, V. Loriette, A. Dubois, J. Moreau, and A. C. Boccara, “Imagery of local defects in multilayer components by short coherence length interferometry,” Opt. Lett. 27(21), 1899–1901 (2002). [CrossRef] [PubMed]
W.-J. Choi, J.-H. Na, S.-Y. Ryu, B.-H. Lee, and D.-S. Ko, “Realization of 3-D topographic and tomographic images with ultrahigh-resolution full-field optical coherence tomography,” J. Opt. Soc. Korea 11(1), 18–25 (2007). [CrossRef]
W.-J. Choi, G.-H. Min, B.-H. Lee, J.-H. Eom, and J.-W. Kim, “Counterfeit detection using characterization of safety feature on banknote with full-field optical coherence tomography,” J. Opt. Soc. Korea 14(4), 316–320 (2010). [CrossRef]

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[1] P. B. Zantye, A. Kumar, and A. K. Sikder, “Chemical mechanical planarization for microelectronics applications,” Mater. Sci. Eng. Rep. 45(3-6), 89–220 (2004). [CrossRef]

[2] D. Stein, D. Hetherington, M. Dugger, and T. Stout, “Optical interferometry for surface measurements of CMP pads,” J. Electron. Mater. 25(10), 1623–1627 (1996). [CrossRef]

[3] R. J. Gutmann, J. M. Steigerwald, L. You, D. T. Price, J. Neirynck, D. J. Duquette, and S. P. Murarka, “Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics,” Thin Solid Films 270(1-2), 596–600 (1995). [CrossRef]

[4] Z. Stavreva, D. Zeidler, M. Plötner, G. Grasshoff, and K. Drescher, “Chemical-mechanical polishing of copper for interconnect formation,” Microelectron. Eng. 33(1-4), 249–257 (1997). [CrossRef]

[5] H. Lu, B. Fookes, Y. Obeng, S. Machinski, and K. A. Richardson, “Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces,” Mater. Charact. 49(1), 35–44 (2002). [CrossRef]

[6] K. H. Park, H. J. Kim, O. M. Chang, and H. D. Jeong, “Effects of pad properties on material removal in chemical mechanical polishing,” J. Mater. Process. Technol. 187-188, 73–76 (2007). [CrossRef]

[7] T. Sun, Y. Zhuang, L. Borucki, and A. Philipossian, “Optical and mechanical characterization of chemical mechanical planarization pad surfaces,” Jpn. J. Appl. Phys. 49(4), 046501 (2010). [CrossRef]

[8] J. McGrath and C. Davis, “Polishing pad surface characterisation in chemical mechanical planarisation,” J. Mater. Process. Technol. 153–154, 666–673 (2004). [CrossRef]

[9] H. Lee, D.-I. Kim, H. Jeong, and K. H. Kim, “Chemical mechanical polishing of a Ti-Si-N nanocomposite and AFM study on its nanostructure,” J. Korean Phys. Soc. 57(4), 845–849 (2010). [CrossRef]

[10] Y. Zhuang, X. Liao, L. J. Borucki, S. Theng, X. Wei, T. Ashizawa, and A. Philipossian, “Effect of pad micro-texture on frictional force, removal rate, and wafer topography during copper CMP process,” Elec. Soc. Trans. 27(1), 599–604 (2010).

[11] S. Nagai, T. Fujishima, and K. Sameshima, “Nondestructive monitoring of CMP pad surface,” IEEE International Symposium on Semiconductor Manufacturing, 343–346 (2003).

[12] D. G. Totzke, A. Belyaev, W. Moreno, S. Ostapenko, I. Tarasov, W. Easter, A. Maury, and A. Crevasse, “Non-destructive characterization of CMP pads using scanning ultrasonic transmission,” AIP Conf. Proc. 550, 259–262 (2001). [CrossRef]

[13] A. Dubois, K. Grieve, G. Moneron, R. Lecaque, L. Vabre, and C. Boccara, “Ultrahigh-resolution full-field optical coherence tomography,” Appl. Opt. 43(14), 2874–2883 (2004). [CrossRef] [PubMed]

[14] W. Y. Oh, B. E. Bouma, N. Iftimia, S. H. Yun, R. Yelin, and G. J. Tearney, “Ultrahigh-resolution full-field optical coherence microscopy using InGaAs camera,” Opt. Express 14(2), 726–735 (2006). [CrossRef] [PubMed]

[15] M. Akiba, N. Maeda, K. Yumikake, T. Soma, K. Nishida, Y. Tano, and K. P. Chan, “Ultrahigh-resolution imaging of human donor cornea using full-field optical coherence tomography,” J. Biomed. Opt. 12(4), 041202 (2007). [CrossRef] [PubMed]

[16] G. Latour, J.-P. Echard, B. Soulier, I. Emond, S. Vaiedelich, and M. Elias, “Structural and optical properties of wood and wood finishes studied using optical coherence tomography: application to an 18th century Italian violin,” Appl. Opt. 48(33), 6485–6491 (2009). [CrossRef] [PubMed]

[17] L. Vabre, V. Loriette, A. Dubois, J. Moreau, and A. C. Boccara, “Imagery of local defects in multilayer components by short coherence length interferometry,” Opt. Lett. 27(21), 1899–1901 (2002). [CrossRef] [PubMed]

[18] W.-J. Choi, J.-H. Na, S.-Y. Ryu, B.-H. Lee, and D.-S. Ko, “Realization of 3-D topographic and tomographic images with ultrahigh-resolution full-field optical coherence tomography,” J. Opt. Soc. Korea 11(1), 18–25 (2007). [CrossRef]

[19] W.-J. Choi, G.-H. Min, B.-H. Lee, J.-H. Eom, and J.-W. Kim, “Counterfeit detection using characterization of safety feature on banknote with full-field optical coherence tomography,” J. Opt. Soc. Korea 14(4), 316–320 (2010). [CrossRef]

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Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)