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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 19, Iss. 14 — Jul. 4, 2011
  • pp: 13343–13350

Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)

Woo June Choi, Sung Pyo Jung, Jun Geun Shin, Danning Yang, and Byeong Ha Lee  »View Author Affiliations

Optics Express, Vol. 19, Issue 14, pp. 13343-13350 (2011)

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Chemical mechanical polishing (CMP) is a key process for global planarization of silicon wafers for semiconductors and AlTiC wafers for magnetic heads. Removal rate of wafer material is directly dependent on the surface roughness of a CMP pad, thus the structure of the pad surface has been evaluated with variable techniques. However, under in situ CMP process, the measurements have been severely limited due to the existence of polishing fluids including the slurry on the pad surface. In here, we newly introduce ultra-high resolution full-field optical coherence tomography (FF-OCT) to investigate the surface of wet pads. With FF-OCT, the wet pad surface could be quantitatively characterized in terms of the polishing pad lifetime, and also be three-dimensionally visualized. We found that reasonable polishing span could be evaluated from the surface roughness measurement and the groove depth measurement made by FF-OCT.

© 2011 OSA

OCIS Codes
(110.4500) Imaging systems : Optical coherence tomography
(120.6660) Instrumentation, measurement, and metrology : Surface measurements, roughness
(240.5450) Optics at surfaces : Polishing

ToC Category:
Instrumentation, Measurement, and Metrology

Original Manuscript: April 21, 2011
Revised Manuscript: June 11, 2011
Manuscript Accepted: June 12, 2011
Published: June 27, 2011

Virtual Issues
Vol. 6, Iss. 8 Virtual Journal for Biomedical Optics

Woo June Choi, Sung Pyo Jung, Jun Geun Shin, Danning Yang, and Byeong Ha Lee, "Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT)," Opt. Express 19, 13343-13350 (2011)

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