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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 19, Iss. 18 — Aug. 29, 2011
  • pp: 17469–17479

Deformation-pattern-based digital speckle correlation for coefficient of thermal expansion evaluation of film

Zhanwei Liu and Jianxin Gao  »View Author Affiliations

Optics Express, Vol. 19, Issue 18, pp. 17469-17479 (2011)

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In this paper, a digital speckle correlation method for coefficient of thermal expansion (CTE) measurement of film is developed, in which CTE is the intrinsic parameter and direct variable. Deformation pattern governed by the CTE and temperature is used to affine transform the image captured after the film is heated. If the values of CTE are properly chosen, the image after affine transformation will have a highest similarity to the original image. This turns CTE measurement into a purely numerical search of an optimal trial CTE. Results of CTEs from this method and conventional DIC methods are compared with the actual CTE, showing an improved accuracy.

© 2011 OSA

OCIS Codes
(100.0100) Image processing : Image processing
(120.0120) Instrumentation, measurement, and metrology : Instrumentation, measurement, and metrology
(310.0310) Thin films : Thin films

ToC Category:
Instrumentation, Measurement, and Metrology

Original Manuscript: June 10, 2011
Revised Manuscript: July 20, 2011
Manuscript Accepted: July 21, 2011
Published: August 22, 2011

Zhanwei Liu and Jianxin Gao, "Deformation-pattern-based digital speckle correlation for coefficient of thermal expansion evaluation of film," Opt. Express 19, 17469-17479 (2011)

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