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Design and fabrication of vertical-injection GaN-based light-emitting diodesHyunsoo Kim, Kyoung-Kook Kim, Sung-Nam Lee, and Kwang-Hyeon Baik »View Author Affiliations
Hyunsoo Kim,1,*
Kyoung-Kook Kim,2
Sung-Nam Lee,2
and Kwang-Hyeon Baik3
1School of Semiconductor and Chemical Engineering and SPRC, Chonbuk National University, Jeonju 561-756, Korea 2Department of Nano-Optical Engineering, Korea Polytechnic University, Siheung 429-793, Korea 3Optoelectronics Lab., Korea Electronics Technology Institute, Seongnam 463-816, Korea *Corresponding author: hskim7@jbnu.ac.kr |
Optics Express, Vol. 19, Issue S4, pp. A937-A942 (2011)
http://dx.doi.org/10.1364/OE.19.00A937
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Abstract
The fabrication process and design issues for the fabrication of vertical-injection GaN-based light-emitting diodes were investigated. The process yield was reduced according to the adhesion of reflective p-electrodes, the exposure of electroplated metal in plasma, and wet-etching induced surface textures. The chip design utilizing current blocking layer and branched n-electrode was found to significantly affect the power efficiency of LEDs.
© 2011 OSA
OCIS Codes
(230.0230) Optical devices : Optical devices
(230.3670) Optical devices : Light-emitting diodes
ToC Category:
Light-Emitting Diodes
History
Original Manuscript: March 21, 2011
Manuscript Accepted: June 9, 2011
Published: July 1, 2011
Virtual Issues
Optics in LEDS for Lighting (2011) Optics Express
Citation
Hyunsoo Kim, Kyoung-Kook Kim, Sung-Nam Lee, and Kwang-Hyeon Baik, "Design and fabrication of vertical-injection GaN-based light-emitting diodes," Opt. Express 19, A937-A942 (2011)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-19-S4-A937
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References
- S. Nakamura, “Current status of GaN-based solid-state lighting,” MRS Bull. 34(02), 101–107 (2009). [CrossRef]
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- K. H. Baik and S. J. Pearton, “Dry etching characteristics of GaN for blue/green light-emitting diode fabrication,” Appl. Surf. Sci. 255(11), 5948–5951 (2009). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
- H. Kim and S.-N. Lee, “Performance characteristics of GaN-based light-emitting diodes fabricated with AgNi, AgCu, and AgAl-alloy reflectors,” J. Vac. Sci. Technol. B 29(1), 0110321–0110325 (2011). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- K. H. Baik and S. J. Pearton, “Dry etching characteristics of GaN for blue/green light-emitting diode fabrication,” Appl. Surf. Sci. 255(11), 5948–5951 (2009). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- H. Kim and S.-N. Lee, “Performance characteristics of GaN-based light-emitting diodes fabricated with AgNi, AgCu, and AgAl-alloy reflectors,” J. Vac. Sci. Technol. B 29(1), 0110321–0110325 (2011). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- H. Kim and S.-N. Lee, “Performance characteristics of GaN-based light-emitting diodes fabricated with AgNi, AgCu, and AgAl-alloy reflectors,” J. Vac. Sci. Technol. B 29(1), 0110321–0110325 (2011). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- S. Nakamura, “Current status of GaN-based solid-state lighting,” MRS Bull. 34(02), 101–107 (2009). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- K. H. Baik and S. J. Pearton, “Dry etching characteristics of GaN for blue/green light-emitting diode fabrication,” Appl. Surf. Sci. 255(11), 5948–5951 (2009). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
Appl. Phys. Lett.
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
Appl. Surf. Sci.
- K. H. Baik and S. J. Pearton, “Dry etching characteristics of GaN for blue/green light-emitting diode fabrication,” Appl. Surf. Sci. 255(11), 5948–5951 (2009). [CrossRef]
IEEE J. Sel. Top. Quantum Electron.
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
IEEE Photon. Technol. Lett.
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
IEEE Trans. Electron. Dev.
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
J. Vac. Sci. Technol. B
- H. Kim and S.-N. Lee, “Performance characteristics of GaN-based light-emitting diodes fabricated with AgNi, AgCu, and AgAl-alloy reflectors,” J. Vac. Sci. Technol. B 29(1), 0110321–0110325 (2011). [CrossRef]
Jpn. J. Appl. Phys.
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
MRS Bull.
- S. Nakamura, “Current status of GaN-based solid-state lighting,” MRS Bull. 34(02), 101–107 (2009). [CrossRef]
Opt. Lett.
- H. Kim, K.-K. Choi, K.-K. Kim, J. Cho, S.-N. Lee, Y. Park, J. S. Kwak, and T.-Y. Seong, “Light-extraction enhancement of vertical-injection GaN-based light-emitting diodes fabricated with highly integrated surface textures,” Opt. Lett. 33(11), 1273–1275 (2008). [CrossRef] [PubMed]
Proc. SPIE
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
2011, Kim, J. Vac. Sci. Technol. B
- H. Kim and S.-N. Lee, “Performance characteristics of GaN-based light-emitting diodes fabricated with AgNi, AgCu, and AgAl-alloy reflectors,” J. Vac. Sci. Technol. B 29(1), 0110321–0110325 (2011). [CrossRef]
- J. O. Song, J.-S. Ha, and T.-Y. Seong, “Ohmic-contact technology for GaN-based light-emitting diodes: Role of p-type contact,” IEEE Trans. Electron. Dev. 57(1), 42–59 (2010). [CrossRef]
- S. Nakamura, “Current status of GaN-based solid-state lighting,” MRS Bull. 34(02), 101–107 (2009). [CrossRef]
- K. H. Baik and S. J. Pearton, “Dry etching characteristics of GaN for blue/green light-emitting diode fabrication,” Appl. Surf. Sci. 255(11), 5948–5951 (2009). [CrossRef]
- H. Kim, J.-H. Ryou, R. D. Dupuis, S.-N. Lee, Y. Park, J.-W. Jeon, and T.-Y. Seong, “Electrical characteristics of contacts to thin film N-polar n-type GaN,” Appl. Phys. Lett. 93, 1921061–1921063 (2008).
- J. K. Kim, A. N. Noemaun, F. W. Mont, D. Meyaard, E. F. Schubert, D. J. Poxson, H. Kim, C. Sone, and Y. Park, “Elimination of total internal reflection in GaInN light-emitting diodes by graded-refractive-index micropillars,” Appl. Phys. Lett. 93, 2211111–2211113 (2008).
- H. Kim, K.-K. Kim, K.-K. Choi, H. Kim, J.-O. Song, J. Cho, K. H. Baik, C. Sone, Y. Park, and T.-Y. Seong, “Design of high-efficiency GaN-based light emitting diodes with vertical injection geometry,” Appl. Phys. Lett. 91(2), 0235101–2035103 (2007). [CrossRef]
- H. Kim, K. H. Baik, J. Cho, J. W. Lee, S. Yoon, H. Kim, S.-N. Lee, C. Sone, Y. Park, and T.-Y. Seong, “High-reflectance and thermally stable AgCu alloy p-type reflectors for GaN-based light-emitting diodes,” IEEE Photon. Technol. Lett. 19(5), 336–338 (2007). [CrossRef]
- V. Härle, B. Hahn, J. Baur, M. Fehrer, A. Weimar, S. Kaiser, D. Eisert, F. Eberhard, A. Plossl, and S. Bader, “Advanced technologies for high-efficiency GaInN LEDs for solid state lighting,” Proc. SPIE 5187, 34–40 (2004). [CrossRef]
- Y. Gao, T. Fujii, R. Sharma, K. Fujito, S. P. Denbaars, S. Nakamura, and E. L. Hu, “Roughening hexagonal surface morphology on laser lift-off (LLO) N-face GaN with simple photo-enhanced chemical wet etching,” Jpn. J. Appl. Phys. 43(No. 5A), L637–L639 (2004). [CrossRef]
- J. S. Kwak, K. Y. Lee, J. Y. Han, J. Cho, S. Chae, O. H. Nam, and Y. Park, “Crystal-polarity dependence of Ti/Al contacts to freestanding n-GaN substrate,” Appl. Phys. Lett. 79(20), 3254–3256 (2001). [CrossRef]
- W. S. Wong, T. Sands, N. W. Cheung, M. Kneissl, D. P. Bour, P. Mei, L. T. Romano, and N. M. Johnson, “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Appl. Phys. Lett. 77(18), 2822–2824 (2000). [CrossRef]
- H. Lee, H. Cho, D. C. Hays, C. R. Abernathy, S. J. Pearton, R. J. Shul, G. A. Vawter, and J. Han, “Dry etching of GaN and related materials: Comparison of techniques,” IEEE J. Sel. Top. Quantum Electron. 4(3), 557–563 (1998). [CrossRef]
- W. S. Wong, T. Sands, and N. W. Cheung, “Damage-free separation of GaN thin films from sapphire substrates,” Appl. Phys. Lett. 72(5), 599–601 (1998). [CrossRef]
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