OSA's Digital Library

Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 20, Iss. 1 — Jan. 2, 2012
  • pp: 568–575

Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets

Yaguo Li, Yongbo Wu, Jian Wang, Wei Yang, Yinbiao Guo, and Qiao Xu  »View Author Affiliations

Optics Express, Vol. 20, Issue 1, pp. 568-575 (2012)

View Full Text Article

Enhanced HTML    Acrobat PDF (996 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



Ultrasonic vibration has been employed to improve the quality of machined surface in the grinding of brittle materials. In this report, we transplant the philosophy of ultrasonic vibration assisted grinding to chemo-mechanical bound-abrasive-pellet polishing in anticipation of the improvement in either surface roughness or material removal rate. The preliminary experimental results show that the ultrasonic vibration assisted chemo-mechanical pellet polishing can yield desired results that material removal rate can be significantly raised while surface roughness is not degraded. The experimental results also indicate different mechanisms between ultrasonic-vibration-assisted chemo-mechanical pellet polishing and conventional chemo-mechanical bound-abrasive polishing.

© 2011 OSA

OCIS Codes
(160.6030) Materials : Silica
(220.4610) Optical design and fabrication : Optical fabrication
(220.5450) Optical design and fabrication : Polishing

ToC Category:
Optical Design and Fabrication

Original Manuscript: September 22, 2011
Revised Manuscript: November 10, 2011
Manuscript Accepted: November 24, 2011
Published: December 22, 2011

Yaguo Li, Yongbo Wu, Jian Wang, Wei Yang, Yinbiao Guo, and Qiao Xu, "Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets," Opt. Express 20, 568-575 (2012)

Sort:  Author  |  Year  |  Journal  |  Reset  


  1. P. P. Hed, “Calculations of material removal, removal rate and Preston coefficient in continuous lapping/polishing machines,” Lawrence Livermore National Laboratory Report, UCRL-ID-115321 (1993).
  2. A. Tesar and B. A. Fuchs, “Removal rates of fused silica with cerium oxide/pitch polishing,” Proc. SPIE 1531, 80–90 (1992). [CrossRef]
  3. M. J. Cumbo, “Chemo-mechanical Interactions in optical polishing,” Ph.D. Dissertation, Univ. of Rochester, (Rochester, NY, 1993).
  4. R. R. Berggren and R. A. Schmell, “Pad polishing for rapid production of large flats,” Proc. SPIE 3134, 252–257 (1997). [CrossRef]
  5. Y. Li, J. Hou, Q. Xu, J. Wang, W. Yang, and Y. Guo, “The characteristics of optics polished with a polyurethane pad,” Opt. Express 16(14), 10285–10293 (2008). [CrossRef] [PubMed]
  6. D. Golini and S. D. Jacobs, “Physics of loose abrasive microgrinding,” Appl. Opt. 30(19), 2761–2777 (1991). [CrossRef] [PubMed]
  7. T. G. Bifano, T. A. Dow, and R. O. Scattergood, “Ductile-regime grinding: a new technology for machining brittle materials,” J. Eng. Ind. 113(2), 184–189 (1991). [CrossRef]
  8. B. K. A. Ngoi and P. S. Sreejith, “Ductile regime finish machining – a review,” Int. J. Adv. Manuf. Technol. 16(8), 547–550 (2000). [CrossRef]
  9. H. Ohmori and T. Nakagawa, “Analysis of mirror surface generation of hard and brittle materials by ELID (Electronic In-Process Dressing) grinding with superfine grain metallic bond wheels,” Ann. CIRP 44(1), 287–290 (1995). [CrossRef]
  10. W. Lin, H. Ohmori, Y. Yamagata, and S. Moriyasu, “Improvement in the ground surface roughness of fused silica X-ray mirror with ELID-grinding,” Key Eng. Mater. 238–239, 143–146 (2003). [CrossRef]
  11. A. S. Kumar, H. S. Lim, M. Rahman, and K. Fathima, “A study on the grinding of glass using electrolytic in-process dressing,” J. Electron. Mater. 31(10), 1039–1046 (2002). [CrossRef]
  12. W. Qu, K. Wang, M. H. Miller, Y. Huang, and A. Chandra, “Using vibration-assisted grinding to reduce subsurface damage,” Precis. Eng. 24(4), 329–337 (2000). [CrossRef]
  13. D. E. Brehl and T. A. Dow, “Review of vibration-assisted machining,” Precis. Eng. 32(3), 153–172 (2008). [CrossRef]
  14. B. E. Gillman and S. D. Jacobs, “Bound-abrasive polishers for optical glass,” Appl. Opt. 37(16), 3498–3505 (1998). [CrossRef] [PubMed]
  15. V. V. Rogov, Y. Filatov, W. Kottler, and V. P. Sobol, “New technology of precision polishing of glass optics,” Opt. Eng. 40(8), 1641–1645 (2001). [CrossRef]
  16. Y. D. Filatov, O. Y. Filatov, G. Monteil, U. Heisel, and M. Storchak, “Bound-abrasive grinding and polishing of surfaces of optical materials,” Opt. Eng. 50(6), 063401 (2011). [CrossRef]
  17. A. A. Tesar, B. A. Fuchs, and P. P. Hed, “Examination of the polished surface character of fused silica,” Appl. Opt. 31(34), 7164–7172 (1992). [CrossRef] [PubMed]
  18. A. Tesar, B. Fuchs, and P. Hed, “Improvement in polishing of fused-silica parts,” Appl. Opt. 30(31), 4459 (1991). [CrossRef] [PubMed]
  19. J. Matsuzawa, A. Sugimoto, M. Yoshida, K. Hirai, T. Ashizawa, and Y. Ootsuki, “Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device,” US Patent No. US6615499 B1, (Sep. 9, 2003).
  20. L. Zhou, T. Shiina, Z. Qiu, J. Shimizu, T. Yamamoto, and T. Tashiro, “Research on chemo-mechanical grinding of large size quartz glass substrate,” Precis. Eng. 33(4), 499–504 (2009). [CrossRef]
  21. I. D. Marinesu, M. Hitchiner, E. Uhlmann, W. B. Rowe, and I. Inasaki, Handbook of Machining with Grinding Wheels (CRC Press, 2007), Chap. 20.
  22. C. Brecher, R. Schug, A. Weber, C. Wenzel, and S. Hannig, “New systematic and time-saving procedure to design cup grinding wheels for the application of ultrasonic-assisted grinding,” Int. J. Adv. Manuf. Technol. 47(1–4), 153–159 (2010). [CrossRef]
  23. N. Suzuki, S. Masuda, M. Haritani, and E. Shamoto, “Ultraprecision micromachining of brittle materials by applying ultrasonic elliptical vibration cutting,” in Proceedings of IEEE Conference on Micro-Nano Mechatronics and Human Science (Institute of Electrical and Electronics Engineers, 2004), 133–138.
  24. T. Izumitani, Optical Glass, (1984) (in Japanese) [Translated by the American Institute of Physics (New York, USA, 1986), Chap. 4].
  25. T. Kasai and N. Yasunaga, Precision Grinding for High Additional Value (Nikkan Kogyo Shimbun, Ltd., 2010), Chap. 1.1 (in Japanese).
  26. L. Zhou, H. Eda, J. Shimizu, S. Kamiya, H. Iwase, S. Kimura, and H. Sato, “Defect-free fabrication for single crystal silicon substrate by chemo-mechanical grinding,” Ann. CIRP 55(1), 313–316 (2006). [CrossRef]
  27. B. Lawn, Fracture of Brittle Solids, 2nd ed. (Cambridge University Press, 1993), Chap. 8.

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited