OSA's Digital Library

Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 20, Iss. 7 — Mar. 26, 2012
  • pp: 7886–7894

Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips

Stéphane Bernabé, Christophe Kopp, Marion Volpert, Julie Harduin, Jean-Marc Fédéli, and Hervé Ribot  »View Author Affiliations

Optics Express, Vol. 20, Issue 7, pp. 7886-7894 (2012)

View Full Text Article

Enhanced HTML    Acrobat PDF (1485 KB)

Browse Journals / Lookup Meetings

Browse by Journal and Year


Lookup Conference Papers

Close Browse Journals / Lookup Meetings

Article Tools



Photonic silicon devices are key enabling technologies for next generation High Performance Computers. In this paper, we report the possibility to stack and optically interconnect SOI based photonic chips for future System-In-Package photonic architecture. Combining vertical grating couplers and state-of-the-art flip-chip technology, we demonstrated low loss penalties and wide spectral range optical interconnections between stacked photonic chips.

© 2012 OSA

OCIS Codes
(060.4510) Fiber optics and optical communications : Optical communications
(230.1950) Optical devices : Diffraction gratings
(230.4000) Optical devices : Microstructure fabrication
(250.5300) Optoelectronics : Photonic integrated circuits

ToC Category:
Integrated Optics

Original Manuscript: August 31, 2011
Revised Manuscript: October 21, 2011
Manuscript Accepted: October 21, 2011
Published: March 21, 2012

Stéphane Bernabé, Christophe Kopp, Marion Volpert, Julie Harduin, Jean-Marc Fédéli, and Hervé Ribot, "Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips," Opt. Express 20, 7886-7894 (2012)

Sort:  Author  |  Year  |  Journal  |  Reset  


  1. D. J. Lockwood and L. Pavesi, Silicon Photonics II (Springer, 2011)
  2. D. Van Thourhout, J. Van Campenhout, P. Rojo-Romeo, P. Regreny, C. Seassal, P. Binetti, X. J. M. Leijtens, R. Notzel, M. K. Smit, L. Di Cioccio, C. Lagahe, J. M. Fedeli, and R. Baets, “PICMOS - a photonic interconnect layer on CMOS,” Proc. 33rd Eur. Conf. on Opt. Comm. (ECOC '07), Sep. 16–20 (2007).
  3. C. Kopp, S. Bernabé, B. B. Bakir, J.-M. Fedeli, R. Orobtchouk, F. Schrank, H. Porte, L. Zimmermann, T. Tekin, “Silicon photonic circuits: on CMOS integration, fiber optical coupling, and packaging,” IEEE J. Sel. Top. Quantum Electron. 17, 498–509 (2011).
  4. A. V. Krishnamoorthy, J. E. Cunningham, X. Zheng, I. Shubin, J. Simons, D. Feng, H. Liang, C.-C. Kung, M. Asghari, “Optical proximity communication with passively aligned silicon photonic chips,” IEEE J. Sel. Top. Quantum Electron. 45(4), 409–414 (2009).
  5. J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari, J. G. Mitchell, “Integration and packaging of a macrochip with silicon nanophotonics links,” IEEE J. Sel. Top. Quantum Electron. 17, 546–558 (2011).
  6. P. Castelein, J. M. Debono, M. Fendler, C. Louis, F. Marion, L. Mathieu, and M. Volpert, “Ultra fine pitch hybridization of large imaging detectors,” in Proceedings of IEEE Nuclear Science Symposium Conference (Nuclear Science Symposium, Medical Imaging Conference; Portland, 2003)
  7. S. Bernabé, R. Stevens, M. Volpert, R. Hamelin, C. Rossat, F. Berger, L. Lombard, C. Kopp, J. Berggren, P. Sundgren, and M. Hammar, “Highly integrated VCSEL-based 10Gb/s miniature optical sub-assembly,” in Proceedings of 55th Electronic Components and Technology Conference; (ECTC, Lake Buena Vista, 2005)
  8. M. Volpert, L. Roulet, J. F. Boronat, I. Borel, S. Pocas, and H. Ribot, “Indium deposition processes for ultra fine pitch 3D interconnections,” in Proceedings of 60th Electronic Components and Technology Conference; (ECTC, Las Vegas, 2010)
  9. H. Lu, C. Bailey, “Dynamic analysis of flip-chip self-alignment,” IEEE Trans. Adv. Packag. 28(3), 475–480 (2005). [CrossRef]
  10. H. Tsunetsugu, T. Hayashi, K. Katsura, M. Hosoya, N. Sato, N. Kukutsu, “Accurate, stable, high-speed interconnections using 20- to 30-µm-diameter microsolder bumps,” IEEE. Trans. Compon., Packag. Manuf. Technol., Part A. 20, 76–82 (1997).
  11. D. Taillaert, F. Van Laere, M. Ayre, W. Bogaerts, D. Van Thourhout, P. Bienstman, R. Baets, “Grating couplers for oupling between optical vibers and nanophotonic waveguides,” Jpn. J. Appl. Phys. 45(8A), 6071–6077 (2006). [CrossRef]
  12. C. Kopp, E. Augendre, R. Orobtchouk, O. Lemonnier, J. M. Fedeli, “Enhanced fiber grating coupler integrated by wafer-to-wafer bonding,” J. Lightwave Technol. 29(12), 1847–1851 (2011). [CrossRef]
  13. C. Kopp, A. Chelnokov, “Fiber grating couplers for silicon nanophotonic circuits: design modeling methodology and fabrication tolerances,” Opt. Commun. 282(21), 4242–4248 (2009). [CrossRef]

Cited By

Alert me when this paper is cited

OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.

« Previous Article  |  Next Article »

OSA is a member of CrossRef.

CrossCheck Deposited