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Optics Express

Optics Express

  • Editor: C. Martijn de Sterke
  • Vol. 20, Iss. 7 — Mar. 26, 2012
  • pp: 7886–7894

Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips

Stéphane Bernabé, Christophe Kopp, Marion Volpert, Julie Harduin, Jean-Marc Fédéli, and Hervé Ribot  »View Author Affiliations


Optics Express, Vol. 20, Issue 7, pp. 7886-7894 (2012)
http://dx.doi.org/10.1364/OE.20.007886


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Abstract

Photonic silicon devices are key enabling technologies for next generation High Performance Computers. In this paper, we report the possibility to stack and optically interconnect SOI based photonic chips for future System-In-Package photonic architecture. Combining vertical grating couplers and state-of-the-art flip-chip technology, we demonstrated low loss penalties and wide spectral range optical interconnections between stacked photonic chips.

© 2012 OSA

OCIS Codes
(060.4510) Fiber optics and optical communications : Optical communications
(230.1950) Optical devices : Diffraction gratings
(230.4000) Optical devices : Microstructure fabrication
(250.5300) Optoelectronics : Photonic integrated circuits

ToC Category:
Integrated Optics

History
Original Manuscript: August 31, 2011
Revised Manuscript: October 21, 2011
Manuscript Accepted: October 21, 2011
Published: March 21, 2012

Citation
Stéphane Bernabé, Christophe Kopp, Marion Volpert, Julie Harduin, Jean-Marc Fédéli, and Hervé Ribot, "Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips," Opt. Express 20, 7886-7894 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-7-7886


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References

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