Optics InfoBase > Optics Express > Volume 20 > Issue 8 > Page 8718
|
|
Dark current reduction of Ge photodetector by GeO2 surface passivation and gas-phase dopingMitsuru Takenaka, Kiyohito Morii, Masakazu Sugiyama, Yoshiaki Nakano, and Shinichi Takagi »View Author Affiliations
Mitsuru Takenaka,1,2,*
Kiyohito Morii,1
Masakazu Sugiyama,1
Yoshiaki Nakano,1
and Shinichi Takagi1
1Department of Electrical Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan 2PRESTO, JST, 4-1-8 Honcho Kawaguchi, Saitama 332-0012, Japan *Corresponding author: takenaka@mosfet.t.u-tokyo.ac.jp |
Optics Express, Vol. 20, Issue 8, pp. 8718-8725 (2012)
http://dx.doi.org/10.1364/OE.20.008718
View Full Text Article
Enhanced HTML
Acrobat PDF (944 KB)
Abstract
We have investigated the dark current of a germanium (Ge) photodetector (PD) with a GeO2 surface passivation layer and a gas-phase-doped n+/p junction. The gas-phase-doped PN diodes exhibited a dark current of approximately two orders of magnitude lower than that of the diodes formed by a conventional ion implantation process, indicating that gas-phase doping is suitable for low-damage PN junction formation. The bulk leakage (Jbulk) and surface leakage (Jsurf) components of the dark current were also investigated. We have found that GeO2 surface passivation can effectively suppress the dark current of a Ge PD in conjunction with gas-phase doping, and we have obtained extremely low values of Jbulk of 0.032 mA/cm2 and Jsurf of 0.27 μA/cm.
© 2012 OSA
OCIS Codes
(040.5160) Detectors : Photodetectors
(060.4510) Fiber optics and optical communications : Optical communications
(250.0250) Optoelectronics : Optoelectronics
ToC Category:
Detectors
History
Original Manuscript: February 8, 2012
Revised Manuscript: March 21, 2012
Manuscript Accepted: March 27, 2012
Published: March 30, 2012
Citation
Mitsuru Takenaka, Kiyohito Morii, Masakazu Sugiyama, Yoshiaki Nakano, and Shinichi Takagi, "Dark current reduction of Ge photodetector by GeO2 surface passivation and gas-phase doping," Opt. Express 20, 8718-8725 (2012)
http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-20-8-8718
Sort: Author | Year | Journal | Reset
References
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- S. Park, T. Tsuchizawa, T. Watanabe, H. Shinojima, H. Nishi, K. Yamada, Y. Ishikawa, K. Wada, and S. Itabashi, “Monolithic integration and synchronous operation of germanium photodetectors and silicon variable optical attenuators,” Opt. Express18(8), 8412–8421 (2010). [CrossRef] [PubMed]
- T. Yin, R. Cohen, M. M. Morse, G. Sarid, Y. Chetrit, D. Rubin, and M. J. Paniccia, “31 GHz Ge n-i-p waveguide photodetectors on Silicon-on-Insulator substrate,” Opt. Express15(21), 13965–13971 (2007). [CrossRef] [PubMed]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- Thorlabs Inc, http://www.thorlabs.com .
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- M. D. Jack and J. Y. M. Lee, “DLTS measurements of a germanium MIS interface,” J. Electron. Mater.10(3), 571–589 (1981). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- M. D. Jack and J. Y. M. Lee, “DLTS measurements of a germanium MIS interface,” J. Electron. Mater.10(3), 571–589 (1981). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- M. D. Jack and J. Y. M. Lee, “DLTS measurements of a germanium MIS interface,” J. Electron. Mater.10(3), 571–589 (1981). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- S. Park, T. Tsuchizawa, T. Watanabe, H. Shinojima, H. Nishi, K. Yamada, Y. Ishikawa, K. Wada, and S. Itabashi, “Monolithic integration and synchronous operation of germanium photodetectors and silicon variable optical attenuators,” Opt. Express18(8), 8412–8421 (2010). [CrossRef] [PubMed]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
Appl. Phys. Lett.
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
Electron. Lett.
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
IEEE Electron Device Lett.
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
IEEE J. Quantum Electron.
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
IEEE J. Sel. Top. Quantum Electron.
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
IEEE Photon. Technol. Lett.
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
IEEE Trans. Electron. Dev.
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
J. Appl. Phys.
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
J. Electron. Mater.
- M. D. Jack and J. Y. M. Lee, “DLTS measurements of a germanium MIS interface,” J. Electron. Mater.10(3), 571–589 (1981). [CrossRef]
J. Vac. Sci. Technol. A
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
Jpn. J. Appl. Phys.
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
Nat. Photonics
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
Nature
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
Opt. Express
- D. Ahn, C. Y. Hong, J. Liu, W. Giziewicz, M. Beals, L. C. Kimerling, J. Michel, J. Chen, and F. X. Kärtner, “High performance, waveguide integrated Ge photodetectors,” Opt. Express15(7), 3916–3921 (2007). [CrossRef] [PubMed]
- S. Park, T. Tsuchizawa, T. Watanabe, H. Shinojima, H. Nishi, K. Yamada, Y. Ishikawa, K. Wada, and S. Itabashi, “Monolithic integration and synchronous operation of germanium photodetectors and silicon variable optical attenuators,” Opt. Express18(8), 8412–8421 (2010). [CrossRef] [PubMed]
- T. Yin, R. Cohen, M. M. Morse, G. Sarid, Y. Chetrit, D. Rubin, and M. J. Paniccia, “31 GHz Ge n-i-p waveguide photodetectors on Silicon-on-Insulator substrate,” Opt. Express15(21), 13965–13971 (2007). [CrossRef] [PubMed]
Proc. SPIE
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
Thin Solid Films
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
Other
- Thorlabs Inc, http://www.thorlabs.com .
2011, Takenaka, Jpn. J. Appl. Phys.
- M. Takenaka, K. Morii, M. Sugiyama, Y. Nakano, and S. Takagi, “Gas phase doping of arsenic into (100), (110), and (111) germanium substrates using a metal–organic source,” Jpn. J. Appl. Phys.50, 010105 (2011). [CrossRef]
- Y. Nakakita, R. Nakakne, T. Sasada, M. Takenaka, and S. Takagi, “Interface-controlled self-align source/drain Ge p-channel metal–oxide–semiconductor field-effect transistors fabricated using thermally oxidized GeO2 interfacial layers,” Jpn. J. Appl. Phys.50, 010109 (2011). [CrossRef]
- N. D. Nguyen, E. Rosseel, S. Takeuchi, J. L. Everaert, L. Yang, J. Goossens, A. Moussa, T. Clarysse, O. Richard, H. Bender, S. Zaima, A. Sakai, R. Loo, J. C. Lin, W. Vandervorst, and M. Caymax, “Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology,” Thin Solid Films518(6), S48–S52 (2010). [CrossRef]
- K. Morii, T. Iwasaki, R. Nakane, M. Takenaka, and S. Takagi, “High-performance GeO2/Ge nMOSFETs with source/drain junctions formed by gas-phase doping,” IEEE Electron Device Lett.31(10), 1092–1094 (2010). [CrossRef]
- J. Michel, J. Liu, and L. C. Kimerling, “High-performance Ge-on-Si photodetectors,” Nat. Photonics4(8), 527–534 (2010). [CrossRef]
- K. W. Ang, T. Y. Liow, M. B. Yu, Q. Fang, J. Song, G. Q. Lo, and D. L. Kwong, “Low thermal budget monolithic integration of evanescent-coupled Ge-on-SOI photodetector on Si CMOS platform,” IEEE J. Sel. Top. Quantum Electron.16(1), 106–113 (2010). [CrossRef]
- S. Assefa, F. Xia, and Y. A. Vlasov, “Reinventing germanium avalanche photodetector for nanophotonic on-chip optical interconnects,” Nature464(7285), 80–84 (2010). [CrossRef] [PubMed]
- J. Osmond, G. Isella, D. Chrastina, R. Kaufmann, M. Acciarri, and H. von Kanel, “Ultralow dark current Ge/Si(100) photodiodes with low thermal budget,” Appl. Phys. Lett.94(20), 201106 (2009). [CrossRef]
- H. Y. Yu, S. Ren, W. S. Jung, A. K. Okyay, D. A. B. Miller, and K. C. Saraswat, “High-efficiency p-i-n photodetectors on selective-area-grown Ge for monolithic integration,” IEEE Electron Device Lett.30(11), 1161–1163 (2009). [CrossRef]
- T. Sasada, Y. Nakakita, M. Takenaka, and S. Takagi, “Surface orientation dependence of interface properties of GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” J. Appl. Phys.106(7), 073716 (2009). [CrossRef]
- H. Matsubara, T. Sasada, M. Takenaka, and S. Takagi, “Evidence of low interface trap density in GeO2/Ge metal-oxide-semiconductor structures fabricated by thermal oxidation,” Appl. Phys. Lett.93(3), 032104 (2008). [CrossRef]
- M. Beals, J. Michel, J. F. Liu, D. H. Ahn, D. Sparacin, R. Sun, C. Y. Hong, L. C. Kimerling, A. Pomerene, D. Carothers, J. Beattie, A. Kopa, A. Apsel, M. S. Rasras, D. M. Gill, S. S. Patel, K. Y. Tu, Y. K. Chen, and A. E. White, “Process flow innovations for photonic device integration in CMOS,” Proc. SPIE6898, 689804(2008). [CrossRef]
- T. H. Loh, H. S. Nguyen, R. Murthy, M. B. Yu, W. Y. Loh, G. Q. Lo, N. Balasubramanian, D. L. Kwong, J. Wang, and S. J. Lee, “Selective epitaxial germanium on silicon-on-insulator high speed photodetectors using low-temperature ultrathin Si0.8Ge0.2 buffer,” Appl. Phys. Lett.91(7), 073503 (2007). [CrossRef]
- L. Colace, P. Ferrara, G. Assanto, D. Fulgoni, and L. Nash, “Low dark-current germanium-on-silicon near-infrared detectors,” IEEE Photon. Technol. Lett.19(22), 1813–1815 (2007). [CrossRef]
- O. Fidaner, A. K. Okyay, J. E. Roth, R. K. Schaevitz, Y.-H. Kuo, K. C. Saraswat, J. S. Harris, and D. A. B. Miller, “Ge–SiGe quantum-well waveguide photodetectors on silicon for the near-infrared,” IEEE Photon. Technol. Lett.19(20), 1631–1633 (2007). [CrossRef]
- S. J. Koester, J. D. Schaub, G. Dehlinger, and J. O. Chu, “Germanium-on-SOI infrared detectors for integrated photonic applications,” IEEE J. Sel. Top. Quantum Electron.12(6), 1489–1502 (2006). [CrossRef]
- C. O. Cui, K. Gopalakrishnan, P. B. Griffin, J. D. Plummer, and K. C. Saraswat, “Activation and diffusion studies of ion-implanted p and n dopants in germanium,” Appl. Phys. Lett.83(16), 3275–3277 (2003). [CrossRef]
- R. S. Johnson, H. Niimi, and G. Lucovsky, “New approach for the fabrication of device-quality Ge/GeO2 /SiO2 interfaces using low temperature remote plasma processing,” J. Vac. Sci. Technol. A18(4), 1230–1233 (2000). [CrossRef]
- V. Craciun, I. W. Boyd, B. Hutton, and D. Williams, “Characteristics of dielectric layers grown on Ge by low temperature vacuum ultraviolet-assisted oxidation,” Appl. Phys. Lett.75(9), 1261–1263 (1999). [CrossRef]
- H. C. Luan, D. R. Lim, K. K. Lee, K. M. Chen, J. G. Sandland, K. Wada, and L. C. Kimerling, “High-quality Ge epilayers on Si with low threading-dislocation densities,” Appl. Phys. Lett.75(19), 2909–2911 (1999). [CrossRef]
- S. B. Samavedam, M. T. Currie, T. A. Langdo, and E. A. Fitzgerald, “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers,” Appl. Phys. Lett.73(15), 2125–2127 (1998). [CrossRef]
- Y. Wang, Y. Z. Hu, and E. A. Irene, “Electron cyclotron resonance plasma and thermal oxidation mechanisms of germanium,” J. Vac. Sci. Technol. A12(4), 1309–1314 (1994). [CrossRef]
- E. E. Crisman, J. I. Lee, P. J. Stiles, and O. J. Gregory, “Characterisation of n-channel germanium mosfet with gate insulator formed by high-pressure thermal oxidation,” Electron. Lett.23(1), 8–10 (1987). [CrossRef]
- S. Luryi, A. Kastalsky, and J. C. Bean, “New infrared detector on a silicon chip,” IEEE Trans. Electron. Dev.31(9), 1135–1139 (1984). [CrossRef]
- S. Kagawa, T. Kaneda, T. Mikawa, Y. Banba, and Y. Toyama, “Fully ion-implanted p+ -n germanium avalanche photodiodes,” Appl. Phys. Lett.38(6), 429–431 (1981). [CrossRef]
- M. D. Jack and J. Y. M. Lee, “DLTS measurements of a germanium MIS interface,” J. Electron. Mater.10(3), 571–589 (1981). [CrossRef]
- H. Ando, H. Kanbe, T. Kimura, T. Yamaoka, and T. Kaneda, “Characteristics of germanium avalanche photodiodes in the wavelength region of 1-1.6 μm,” IEEE J. Quantum Electron.14(11), 804–809 (1978). [CrossRef]
Cited By |
OSA is able to provide readers links to articles that cite this paper by participating in CrossRef's Cited-By Linking service. CrossRef includes content from more than 3000 publishers and societies. In addition to listing OSA journal articles that cite this paper, citing articles from other participating publishers will also be listed.
Related Journal Articles 
- Rapid ultrafine-tunable optical delay line at the 1.55-μm wavelength (OL)
- Adaptive Optoelectronic Signal Processor with Metal-Semiconductor-Metal Photodetector Arrays (AO)
- Gallium Arsenide Metal–Semiconductor–Metal Photodiodes as Optoelectronic Mixers for Microwave Single–Sideband Modulation (AO)
- Misalignment Tolerance Analysis of Free-Space Optical Interconnects Via Statistical Methods (AO)
- Optical wireless communications within fourth-generation wireless systems [Invited] (JON)
Related Conference Papers 
- A high power and high efficiency photodiode with an evanescently coupled graded index waveguide for 40 gbps applications
- Transmission of Classical Information Over a Noisy Quantum Channel
- Transmission of Classical Information Over a Noisy Quantum Channel
- Feasibility of 320Gbit/s OTDM Add/Drop Multiplexing Using an Optimized GT-SOA-MZI Gate
- Measurement of the Lifetimes of Photo-Excited Carriers in Type-I and Type-II Quantum Well Materials
- First Commercial Service of a Colorless Gigabit WDM/TDM Hybrid PON System
- First Commercial Service of a Colorless Gigabit WDM/TDM Hybrid PON System
- Firefox 11+
- Google Chrome 17+
- Internet Explorer 9+
- Safari 5+




OSA is a member of 